onsemi is seeking a Etch Process Development (UPD) engineer for wide bandgap technology. This role is a critical hands-on role within the operations organization to design/optimize new SiC power technologies to be manufacturable, cost competitive and high quality. This role will interface regularly with the Bucheon Korea manufacturing team, Power Solution Group (PSG) technology development teams, PSG new product and test engineering organizations and Corporate Quality organizations.
The successful candidates are expected to be able to work independently as well as within teams. They should possess analytical and proven semiconductor process integration skills to identify and solve problems, strong ownership and driving improvement across all aspects of new technology from pathfinding to production ramp.
Onsemi is seeking a Etch Process Development process engineer for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies. These engineers will need to work with process integration engineering team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery.
These are “hands on” positions. The successful candidates are expected to be able to work independently as well as within teams. They should possess analytical skills to identify problems, the leadership skills to own and drive improvement across all aspects of new technology from feasibility to production ramp.
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Responsibilities
Identify the gaps in global operations and be strong team members of unit process development engineers for technology development from feasibility to production ramp.
Develop capable processes that fit unified technology design rules.
Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices by collaborating with process integration and device engineering team.
Participate as operations representative for due diligence projects for wide band gap power products
Own process development and qualification through collaboration with process integration engineers and device engineers to successfully qualify and ramp wide band gap products.
Improve yield and cost through securing wide process window and complete understanding and reduction of process defects as a process owner.
Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP).
Qualificaton
A minimum of 3years of experience in semiconductor engineering related field in Dry Etch process. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines.
Minimum 3+ years of hands-on experience in 8” fab with at least 0.25 um technology
Experience with wide band gap technologies
Developed and successfully ramped a technology to at least 1K wafers per a week
Experience in working and leading cross functional teams and remote factories
Ability to drive changes
Willing to travel up to 20% of the time as required.
Bucheon, Korea as a main work site.
