onsemi
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Power Semiconductor Assembly EOL Process Development
Technical Leadership on Enabling Technology Development and Feasibility Study in Pro-typing Line
Technical Leadership on Responsible Processes between Package development and Manufacturing
Proto Typing Samples Building Satisfying Cycle time and Quality
Support Process Development team under ATPDG
1. Responsible for Assembly Process Development and Characterization for Code-S and Enabling Technology in Semiconductor EOL (End of Line) area as Process Development Engineer.
A. Capable to understand and discuss proposed design and new proposal upgraded
B. Capability understanding Design FMEA, upgrading DFMEA and making Process FMEA from DFMEA
C. Capability to define KPIV from FMEA Failures Modes
D. Capability to define KPOV and making result of KOPV and analysis from it
E. Responsible for providing Technical reports with satisfying KPIV versus KPOV from FMEA failures modes based on JMP analysis
F. Working with development engineers to generate and create documents deliverables such as preliminary Control Plan from D/PFMEA according to APQP procedure
G. Responsible for Sharing and Communication with Development Engineers and Manufacturing Engineers
2. Pro typing Line Sample Building and Line Equipment’s Maintenance & Management
A. Capable for Equipment and Tooling Set-up
B. Responsible for Tool and JIG design working with designers and vendors for new development tool designs
C. Responsible for readiness of tools and Jigs meeting target schedule without EON owner’s schedule impacts to generate proper outputs within schedule
D. Responsible to meet EON cycle time on Technology Development
E. Leading Proto Typing Line Operators to do right job
F. Sharing technical issues and new result to related EON owners and manufacturing engineering team
3. Technical Leadership on Assembly Process
A. Capable to initiate new Process and new Equipment working with development engineers and vendors
B. Responsible for PO Spec. generation and Buy-off
C. Capable to create COO for Process and Equipment Comparison
D. Capable for Benchmarking New and Better Process and Equipments that does not exist in company
E. Capability to create Assembly Technology Roadmap
F. Capability to generate Characterization and out of design Rule by Co-work with Dev. Engineer and NPI Process engineers
G. Capable to understand customer requirements, application, EHS and design
H. Capable to find technical and systematic solution and schedule for failures of process, reliability, quality, manufacturability, cost, and cycle time that are related with process
I. Supporting Production Related Quality Issues for Manufacturing
J. Leading the Pre-work and supporting Code-S with NPI Process Engineers
K. To share and update project progress, risk of delay, constraints by weekly report and update technical Web site and report to manager
Experienced years : Longer than 5 years in EOL Process, PKG Saw/ Jig Saw experience is a must
Experienced areas : End of Line Process (Mold, Trim/Form, Sn Plating, LASER Marking, Laser Deflash), Preferred Design Career and Equipment Engineering Experience
Experienced jobs : Semiconductor Assembly Process Development, Equipment and Tooling set-up, process/equipment/material troubleshooting and control, Purchase spec/selection, Qualification for equipment and material, Experience of consulting on Leadframe design and understanding FOL area
Education: 4yrs college or preferred Master Degree, Preferred Mechanical, Electric and automation Engineering
Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, JMP & Data analysis. Skilled Excel Spreadsheet and Power Point Presentation, AutoCAD
Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk and managing
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