onsemi is seeking a Manufacturing Integration Engineer at our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and motivated Engineer to join our team and drive technology transfer and Manufacturability of next‑generation discrete power FET technologies. This role offers high technical ownership, cross‑functional visibility, and the opportunity to directly shape onsemi’s future power device roadmap
Technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, with device architecture ownership from concept definition through qualification and high‑volume manufacturing.
Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.
Perform device characterization, electrical testing, and failure analysis to ensure compliance with specifications and customer requirements.
Drive structured root‑cause analysis (DOE, 6‑sigma, SPC, FMEA) for yield, reliability, or device‑related issues, and implement sustainable corrective actions.
Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system‑level solutions and end‑customer applications.
Present technical content in executive‑level reviews
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Qualifications
Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
5+ years of experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunctions, or related structures).
Understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.
Experience taking technologies from early manufacturing to high volume ramp.
Demonstrated ability to translate high‑level objectives into actionable engineering plans and to drive projects independently.
Strong data‑driven problem‑solving skills using DOE, statistical analysis, SPC, 6‑sigma, and FMEA methodologies.
Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
Ability to manage multiple projects simultaneously in a fast‑paced development environment
Prefer experience with post-wafer fab operations, including Back-Grind/Back Metallization, Packaging, Dicing and Singulation, and module construction.
Prefer experience with wafer-level testing, ILT/WAT/PCM and Probe. Familiarity with package-level final testing, especially for discrete power devices
Salary: onsemi is excited to share the base salary range for this position is $114,000 to $1193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
