onsemi
From onsemi's careers page
Status: listed on the employer's own careers page when we last checked (daily). Confirm on their site before applying.
Responsible for failure analysis (FA) of Logic, Mixed Signal, Power ICs, Discrete, Interface, RF Power & Optoelectronic devices.
Failure analysis will be performed on failures from wafer fabrication or package assembly, reliability stress test failures, qualification fails, customer returns as well as new product and process introduction fails.
This is a hands-on technical problem solving position focusing on package and die level analysis to determine root cause of device failure. Includes electrical bench verification & characterization of failures as well as non-destructive analysis (such as X-ray, acoustic analysis & package inspection). Circuit schematics, layouts, and fault isolation techniques will be utilized to determine the failing location.
Must be familiar with the use of a wide range of AC and DC test equipment including parametric analyzers, curve tracers, and oscilloscopes.
This position involves the utilization of a wide range of deprocessing as well as analytical equipment including topside & backside decapsulation, layer by layer removal using wet and dry etching as well as the use of analytical techniques including Scanning Electron Microscopes (SEM), Focus Ion Beam (FIB), Confocal Laser Scanning Microscope (CLSM), Photon Emission Microscopy (EMMI), Thermal Induced Voltage Alterations (TIVA), and Energy Dispersive X-rays (EDX).
Responsibilities include the generation of high quality Product Analysis Reports to the internal engineering and manufacturing staff as well as customers.
Developmental aspects involve identifying and implementing advanced methods of circuit failure analysis.
Must have detailed understanding of semiconductor physics, MOS & bipolar junction transistor theory of operation, and a detailed transistor level understanding of a variety of analog & logic circuits required. Knowledge of semiconductor manufacturing processes including wafer fab, assembly and test required.
Candidates must excel at multitasking, working in a team environment and have excellent problem solving skills. Position involves working with chemicals (acids, solvents). In addition to direct FA experience, candidate should be proficient in Windows, Excel, Power point as well as lab computing systems.
Will drive quality improvement and provide corrective action recommendations as well as conduct hands-on failure analysis activities.
Train others in physics of failure, analytical techniques and methodologies as well as benchmark FA methods, systems and operations against other semiconductor manufacturers.
Responsible for entering data into database, overseeing case activity, updates and insuring timely completion of FA activities.
Entry Level: No prior experience required, though previous experience is desired.
Mid Level Engineer : Minimum 3 years experience in Failure Analysis of devices
Senior Engineer Level: Minimum 5-7 years experience in Failure Analysis of devices
Must be proficient in English
Minimum Bachelor of Science (BS, 4yr degree) in Electrical Engineering (EE) or Master of Science degree in Electrical Engineering (preferred). *BS degree in Microelectronics also considered.
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