Job Summary
onsemi is looking for an Assembly Quality Engineer who is responsible for ensuring product quality, process stability, and continuous improvement across Front of Line (FOL) semiconductor assembly operations, including Wafer Saw, Die Attach/Die Bond, and Wire Bond processes. This role drives defect prevention, yield improvement, customer satisfaction, and compliance with quality management system requirements through data analysis, problem-solving, process audits, and collaboration with cross-functional teams.
Monitor and analyze quality performance metrics for Wafer Saw, Die Bond, and Wire Bond processes.
Lead investigation of assembly-related defects, yield excursions, customer complaints, and manufacturing non-conformances using structured problem-solving methodologies (8D, DMAIC, 5 Why, Fishbone Analysis).
Implement and verify corrective and preventive actions to eliminate recurring quality issues.
Drive continuous improvement projects focused on defect reduction, process capability improvement, yield enhancement, and cost of poor quality reduction.
Review Statistical Process Control (SPC) data, process capability indices (Cp/Cpk), and quality trends to identify risks and opportunities for improvement.
Support qualification and validation activities for new products, materials, equipment, and process changes.
Conduct process, product, and system audits to ensure compliance with internal procedures, customer requirements, and industry standards.
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Partner with Manufacturing and Process Engineering teams to establish robust controls and quality checkpoints.
Develop and maintain quality documentation, including Control Plans, PFMEA, Inspection Standards, and Work Instructions.
Participate in customer audits and support responses to customer quality concerns and corrective actions.
Ensure compliance with ISO 9001, IATF 16949 (where applicable), and company quality management system requirements.
Facilitate containment activities during quality incidents and coordinate disposition of non-conforming materials.
Requirements
Bachelor's Degree in Engineering (Electronics, Electrical, Mechanical, Industrial, Materials Science, or related discipline).
Minimum 5 years of experience in semiconductor assembly manufacturing and quality engineering.
Strong knowledge of Front of Line assembly processes including Wafer Saw, Die Attach/Die Bond, and Wire Bond.
Experience in semiconductor quality tools and methodologies such as SPC, FMEA, MSA, Control Plans, DOE, CAPA, and Root Cause Analysis.
Working knowledge of semiconductor package construction, assembly materials, and reliability requirements.
Experience in interpreting engineering drawings, specifications, and process standards.
Strong analytical, troubleshooting, and data interpretation skills.
Proficiency in quality reporting and statistical analysis tools (Minitab, JMP, Excel, Power BI, or equivalent).
Excellent communication and cross-functional collaboration skills.
Preferred Skills
Experience supporting automotive semiconductor products and IATF 16949 requirements.
Knowledge of Lean Manufacturing and Six Sigma methodologies (Green Belt Six Sigma is an advantage).
Familiarity with Backend process and semiconductor reliability testing.
