Participate in new product development activities and technology roadmaps.
Mentor junior designers in power design concepts.
Mechanical, Thermal, and Electrical Optimization
Design packages considering
Thermal management and heat dissipation requirements.
Electrical isolation, parasitic inductance, and current-carrying capability.
Mechanical robustness, stress management, and reliability under environmental conditions.
Evaluate material selections, substrate technologies, interconnect methods, encapsulation systems, and cooling approaches.
Support simulation activities and interpretation of mechanical, thermal, and electrical modeling results.
Design Validation & Manufacturing Support
Collaborate with manufacturing teams to ensure designs are producible and scalable.
Support prototype builds, qualification activities, and root-cause analysis of packaging-related failures.
Drive continuous improvement initiatives focused on performance, reliability, cost, and manufacturability.
Education
Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Packaging Engineering, or a related field.
Experience
5-6+ years of experience in package design, semiconductor packaging, power electronics packaging, or related engineering disciplines.
Advanced expertise in APD (Advanced Package Designer) and 3D modeling tools.
Demonstrated experience designing power module packages for industrial, automotive, renewable energy, or high-power applications.
Technical Skills
Expert proficiency in
Cadence APD (Advanced Package Designer)
3D CAD modeling tools (e.g., SolidWorks (preferred), Creo, or equivalent)
Strong understanding of
Power module packaging technologies
Semiconductor packaging principles
DBC, AMB, leadframe, and advanced substrate technologies
Wire bond and advanced interconnect technologies
Thermal interface materials and cooling solutions
Strong knowledge of
Mechanical design principles
Thermal management and heat transfer
Electrical design considerations including creepage, clearance, insulation, and parasitic effects
Experience interpreting thermal, mechanical, and electrical simulation results.
Familiarity with design for manufacturability (DFM), design for assembly (DFA), and reliability principles.
