6+ years of relevant experience in an R&D environment.
Strong expertise in finite element analysis (FEA), thermal analysis, and computational fluid dynamics (CFD).
Proven experience correlating simulation results with physical testing to enhance model accuracy.
Deep proficiency with simulation tools such as Ansys (Icepak, Workbench, Mechanical, Fluent) and MATLAB.
Demonstrated ability to influence design decisions early through analytical “back-of-the-envelope” calculations and rapid modeling.
Proficiency in 3D CAD tools (Creo preferred).
Excellent written and verbal communication skills in English and Hebrew.
Self-driven, highly motivated, and capable of working both independently and as part of a team.
Strong organizational skills with the ability to manage multiple priorities in a dynamic, cross-functional environment.
Ways to Stand Out from the Crowd
Expertise in electronics cooling and packaging, including thermal interface materials (TIMs), heat sink optimization, and liquid cooling systems (cold plates, manifolds, CDUs).
Strong understanding of structural dynamics, including shock and vibration standards for high-density server environments.
Advanced CAD capabilities (e.g., Creo, SolidWorks, NX), including model preparation for simulation (simplification, defeaturing, mid-surfacing).
Background in global enterprise telecommunications organizations and experience developing and implementing new design methodologies.
Familiarity with AI tools for mechanical design, simulation, and debugging.
NVIDIA is an equal opportunity employer committed to fostering a diverse and inclusive workplace. We do not discriminate based on race, religion, color, national origin, sex, gender identity or expression, sexual orientation, age, marital status, veteran status, or disability. We provide reasonable accommodations throughout the application and employment process.