What you’ll be doing
Lead the technical assessment of package risk across our chip programs — identifying failure modes in substrate, interposer and assembly integration before they reach silicon, quantifying their cost and schedule impact, and bringing them to program and technology reviews with a clear position
Drive new approaches to manufacturability across the board (package, substrate, interposer, silicon), spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity. Push co-design levers such as tolerance relaxation by design, testability before attach, design margins, and redundancy and partial-module recovery
Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly, and convert the findings into concrete design guidance
Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define our product requirements — working closely with our advanced technology group
What we need to see
B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience
More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly
Deep understanding of 2.5D, chiplet and organic substrate integration. Working knowledge of assembly and module yield mechanics, including how alignment tolerance and process excursions drive assembly yield differently from defect density at the die level
Strong analytic capabilities, and passion for solving demanding technical problems
Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations
Ways to stand out from the crowd
Hands-on experience on an assembly floor, a foundry or at an OSAT
Experience with co-packaged optics, photonic packaging, or fiber and laser attach
Proven experience driving design-for-manufacturability into early architecture decisions
Familiar with working on large high-end ASICs and multi-die modules
Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/
