Assist engineering with root‑cause investigations, corrective actions, and process improvement activities.
Verify recipes, parameters, and equipment readiness at the start of each shift.
Support onboarding and hands‑on training for new operators when assigned.
Follow cleanroom protocols, gowning procedures, and safety requirements at all times.
Communicate clearly with shift leads, engineers, and supervisors regarding issues, delays, or material status.
Report equipment alarms, quality concerns, or process deviations promptly.
Support engineering experiments, DOE runs, and process qualifications as needed.
JOB REQUIREMENTS INCLUDE
Education: High School Diploma or equivalent required. College degree preferred.
Experience: Three to Five years related experience required.
Must be a U.S. person or Valid Green card holder
Preferred Experience & Qualifications
Hands‑on experience operating and maintaining die sorting platforms (Royce MP300, AP+, Mulhabuer Ecoline, Mi30) and AOI inspection systems such as Camtek Eagle AG.
3–5 years of experience in semiconductor assembly, die sort, or wafer‑level manufacturing.
Familiarity with wafer‑level processes (backgrind, marking, dicing, inspection) is a plus.
Ability to read and follow technical procedures, travelers, and work instructions.
Strong attention to detail and commitment to quality.
Comfortable working in a cleanroom environment and handling fragile materials.
Basic computer skills for data entry and equipment interfaces.
Ability to lift up to 25 lbs and stand for extended periods.
EMPLOYEE___________________________________________ Date ____________
