At Microsoft, our mission—to empower every person and every organization on the planet to achieve more—guides how we partner with customers to deliver trusted, impactful solutions. With a growth mindset culture, we innovate responsibly and measure success by shared progress—people, teams, and customers. Join us to do meaningful work that changes the world and helps shape what’s next for everyone.
Responsibilities
Device Design: Develop QPU chip designs and interfaces to readout/control layers using simulation-driven, fabrication-aware workflows.
RF Simulation: Perform RF simulations of QPU chips and interface layers to define design requirements and optimize control/readout performance.
Cross-Team Collaboration: Partner with fabrication, systems, packaging, and control teams to co-design QPUs, incorporating constraints and requirements.
Tool Development: Build and maintain design tools, functionalize devices into models, and enable co-design with internal teams and external partners.
Process Optimization: Apply integrated circuit design principles and engineering best practices to improve design processes and recommend optimizations.
Other
Embody our Culture and Values
Qualifications
Required/Minimum Qualifications
Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience
OR equivalent experience
Other Requirements
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Additional or Preferred Qualifications
Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience
OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience
OR equivalent experience
3+ years of experience in chip or printed circuit board (PCB) design involving quantum devices, mixed-signal integrated circuits, high-speed RF/digital circuits, or equivalent relevant experience.
Proficiency with industry-standard or custom chip and circuit design tools, including electronic design automation (EDA) tools for integrated circuit (IC), application-specific integrated circuit (ASIC) design, physical design, and verification.
Experience with RF circuit and electromagnetic simulation for device, chip, and interconnect modeling and optimization, using tools such as Ansys, Sigrity, COMSOL, Cadence, or Simulation Program with Integrated Circuit Emphasis (SPICE)-based simulators.
Experience with device and chip thermal modeling, preferably in quantum or cryogenic operating regimes, using Ansys, COMSOL, or custom modeling packages.
Experience with semiconductor device design and fabrication processes, including process design kits (PDKs), along with Python programming and collaborative development using Git/GitHub.
Knowledge of quantum computing principles and hands-on quantum hardware experience, such as superconducting-qubit or spin-qubit systems.
Ability to work in an “AI-first” environment using modern AI tools to accelerate discovery through both hardware and software development.
Design and build AI agents/copilots that assist with experiment setup, log triage, measurement report generation, protocol templating, and knowledge retrieval (e.g. instrument manuals, design docs).
#Quantum #QuantumCareers #MDQCareers
Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
- Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
- https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.
