Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior.
Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior
Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements and design direction
Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies, while mentoring engineers and establishing guidelines.
Lead the evaluation, adoption, and responsible use of AI-enabled solutions within engineering workflows, translating emerging AI capabilities into practical business value through improved productivity, innovation, quality, and speed of execution
Minimum Qualifications
PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field
Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies
Strong foundation in heat transfer, thermodynamics, and solid mechanics
Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM)
Demonstrated expertise in modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects
Advanced experience with finite element modeling (FEM), coupled thermal-structural simulations, model calibration, and technical problem solving for complex systems
Preferred Qualifications
Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers
Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems
Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques
Exposure to CFD or flow-based simulation for cooling or package-level heat transfer.
Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
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