Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.
Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions
Minimum Qualifications
Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
Experience with HBM and logic integration, including thermal optimization
Experience supporting cross-functional engineering programs in a fast-paced development environment
Preferred Qualifications
Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field
Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies
Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency
Experience authoring technical papers, patents, or engineering documentation
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