Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end‑to‑end design execution
Support silicon bring‑up, characterization, failure analysis, and architecture‑to‑design handoff
Qualifications
Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent)
Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms
Hands‑on experience with SPICE‑based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent)
Ability to evaluate performance, power, area, thermal, and reliability trade‑offs
Experience driving architecture decisions and cross‑functional technical execution
Strong problem‑solving and communication skills
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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