What You’ll Do
Lead next-generation data center switch and rack-scale system hardware architecture from concept through product delivery.
Define switch platform architectures for
Data center leaf/spine and top-of-rack switches
AI scale-up switch systems and rack-level interconnect systems
High-density liquid-cooled rack-scale integrated systems
Assess the hardware evolution of data center switches, AI server and rack systems; develop 2-3 year technology roadmaps through technology and competitive analysis, identify and select the key next-generation technologies, and establish the justification for new programs.
Decompose system-level requirements into mechanical, thermal, power, interconnect and manufacturability subsystems; develop system block diagrams, topology and architecture specifications and drive solutions to closure.
Define high-speed interconnect architecture including switch chip selection, high-speed PCB channels, connectors, copper cables and optics, in close cooperation with SI/PI teams.
Define power architecture for switch systems, covering PSU and power shelf selection, 48V/12V distribution, hot-swap and protection, efficiency and thermal coupling at rack level.
Define mechanical and thermal architecture for switch and rack-scale systems, covering air and liquid cooling, serviceability and rack integration, and own the rack-scale platform from design through mass production.
Conduct architecture trade-off studies across bandwidth, radix, latency, power, thermal, density, reliability, serviceability, manufacturability, cost and time-to-market.
Drive high-availability and RAS architecture, including redundancy, hot swap, fault isolation, recovery, telemetry and serviceability.
Align with network architecture and teams to ensure fabric requirements such as lossless Ethernet/RoCE and InfiniBand are reflected in switch hardware design, and work with SI/PI, power, thermal, mechanical, firmware/network OS, validation and software teams to optimize the complete system design.
Basic Qualifications
Bachelor’s degree in Electrical Engineering, Electronic Engineering, Telecommunication Engineering, Microelectronics, Computer Engineering, Computer Science or related field.
10+ years of datacom hardware system development experience, with a proven record of leading router, switch or server system programs.
Deep expertise in at least one of mechanical structure, thermal or power, with solid working knowledge of the other two, plus demonstrable cases of leading cross-discipline design and manufacturing issue resolution.
Strong understanding of switch system architecture, including switch ASIC and SerDes, high-speed PCB and interconnect, optics and copper cabling, power and thermal design, plus strong system-level trade-off capability.
Working knowledge of Ethernet switching, TCP/IP and network virtualization sufficient to translate fabric requirements into switch hardware requirements, with familiarity of InfiniBand/RoCE loss less network requirements.
Preferred Qualifications
Master’s degree in Electrical, Computer or Telecommunication Engineering or related field.
AI data center experience in rack-level scale-up interconnect, high-density liquid-cooled rack systems, or large-scale AI cluster network deployment with InfiniBand/RoCE fabrics, including design and mass production.
Experience defining a product from 0 to 1, with knowledge of switch silicon and ASIC roadmaps, 800G/1.6T optics, copper cables and connector technologies, and OCP/Open Rack/rack-scale infrastructure standards.
Strong architecture leadership, communication and executive presentation skills.
We are an Equal Opportunity Employer and do not discriminate against any employee or applicant for employment because of race, color, sex, age, religion, sexual orientation, gender identity, national origin, status as a veteran, and basis of disability or any federal, state, or local protected class.
Additional Locations
United States of America
United States of America
PAY TRANSPARENCY
The anticipated annual compensation range for this position is 184,800–283,360 USD. Final compensation will be based on relevant experience, skills, and business considerations. Individuals may also be considered for bonuses and/or commissions. Lenovo’s various benefits can be found at www.lenovobenefits.com
In compliance with Colorado’s Equal Pay for Equal Work Act (EPEWA), the expected application deadline for this position is 12-07-2026. This requirement applies to both internal and external candidates.
