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Primary Responsibilities
Co-lead and develop the manufacturing engineering team supporting PCBA assembly and complimentary processes such as selective solder, press-fit, conformal coating, board washing, etc..
Drive continuous improvement projects to increase yield, throughput, and quality across the production line and specialized equipment.
Monitor manufacturing KPIs (yield, first-pass yield, cycle time, scrap, escapes) to predict trends and drive proactive process changes.
Perform DFM/DFA reviews on new product introductions and design changes, providing feedback to design engineering.
Develop, document, and implement new manufacturing processes, work instructions, and process control plans.
Identify, specify, and justify capital equipment for PCBA assembly, conformal coating, and related manufacturing processes.
Support root cause analysis, corrective action, and disposition of manufacturing and quality nonconformances.
Partner with quality, production control, and design teams to meet delivery schedules and customer quality requirements.
Support quality engineering in process development and onsite audits
Establish and monitor quality objectives of the production process
Mentor and develop junior engineers in process development, root cause analysis,and mitigation
Basic Qualifications
Requires a BS degree and 12-15 years of prior relevant experience or Masters with 10-12 years of prior relevant experience. In lieu of a degree, a highschool diploma/GED with 15 years of experience will be considered
Must be a U.S. Citizen and be able to obtain/maintain a finalSecret Clearance
Previous experience working in PCBA manufacturing and process development
Strong background in Design for Manufacturability (DFM) to optimize product designs for production efficiency.
Candidate must be a resident of Huntsville, Alabama or be willing to relocate to the Huntsville, Alabama area.
Preferred Qualifications
Familiarity with IPC requirements (J-STD-001 and IPC-A-610)
Experience with electronics used on launch vehicles, targets, or missile components such as PCBAs, cable harnesses, or electro-mechanical assemblies
Experience with Costpoint Material Planning software and/or Windchill product lifecycle management software is a plus.
Experience working in a mid to high volume manufacturing environment
Ability to provide Rough Order of Magnitude (ROM) estimates, Basis of Estimate (BOE) documents, and other information to support proposal efforts
Demonstrated success in implementing lean principles to reduce waste and improve efficiency.
Experience in using Manufacturing Execution Systems (MES) such as Aegis Factory Logix is also a plus.
Hands-on experience with PCBA automation equipment, such as SMT mounters, selective solder, board wash, press-fit, AOI, and general soldering equipment.
If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo — because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 — and moving faster than anyone else dares.
Original Posting
November 6, 2026
For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range
Pay Range $116,350.00 - $210,325.00
The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.
