What you’ll do
Subject matter expertise in logic and memory advanced packaging integration including 2D/2.5D/3D, WLP, HBM, etc.
Ability to synthesize customer AP roadmap needs, generate process integration flow options, identify unit process challenges, and propose solution paths to enable highest possible product performance, yield, and reliability.
Engage closely with PG engineering and customer account technologist teams on test vehicle needs for improved unit process development and characterization, help develop test vehicle flows.
Study system-level co-optimization trends across different logic and memory product and process segments, identify emerging challenges and critical HW and process needs that Lam products need to develop to stay differentiated and ahead of competition.
Design experiments, lead data analysis, and drive systematic root-cause + corrective actions as needed to resolve process integration problems.
Along with ecosystem engagement lead and program managers, develop clear JDP scope, objectives, KPIs/success metrics, and milestones.
Engage and lead collaborations with peers/partners/startups to define, execute, and implement co-optimized integration strategies and solutions.
Drive JDPs with materials suppliers and metrology companies to realize and enable new avenues for co-development and characterization.
Stay up to date on advanced packaging research, pathfinding, and innovations and assist product marketing leaders in market assessments, competitive intelligence reports, strategic initiatives, and portfolio gap analysis.
Support customer engagement meetings and escalations related to integrated problems.
Represent Lam at industry conferences and symposiums to expand network, influence, and branding.
Support mentoring and recruitment for the ecosystem team.
Who we’re looking for
Master's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or a related discipline.
10+ years of experience in semiconductor process development, packaging integration (TSV, WLP, HB, panel level packaging etc.), model-based problem solving, program management, or related business functions within a complex enterprise environment.
Strong fundamental understanding of advanced packaging technologies and integration, industry direction, and research initiatives.
Proficiency in statistical data analysis, process controls, optimization, and utilizing AI tools for efficiency.
Excellent communication and problem-solving skills with the ability to collaborate extensively within and outside Lam Research.
Demonstrated experience partnering with senior executives and business stakeholders to define strategy, prioritize investments, and deliver business outcomes.
Experience managing cross-functional programs and influencing stakeholders in a global, matrixed organization.
Preferred qualifications
Experience with initiation, definition, and execution of joint development projects with research institutes, industry consortia, and academic institutions.
Semiconductor, capital equipment, industrial technology, or advanced manufacturing industry experience.
Strong network across the industry ecosystem and research communities.
Highly effective in ambiguous situations, capable of making high-impact decisions with incomplete data to ensure programs stay on track and on schedule.
Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.
In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
Working knowledge of statistical analysis and problem-solving methodologies.
Experience with statistical tools (JMP, Minitab, etc.).
Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma-Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD).
Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).
Knowledge of material synthesis and material characterization.
Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.
Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc.
Our commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.
Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.
Our Perks and Benefits
At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.
