What You'll Do
Design, develop, and execute reliability qualification strategies for advanced packaging, heterogeneous integration, interposer technologies, and high-performance interconnect solutions.
Evaluate emerging packaging and integration technologies, ensuring they meet the stringent reliability requirements of high-performance Test & Measurement applications.
Investigate package- and interconnect-level degradation mechanisms and develop qualification methodologies that accurately predict field performance and lifetime.
Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions.
Build and expand package reliability characterization infrastructure, enabling rapid assessment of new technologies while supporting future growth in capability and test capacity.
Partner with technology development, product engineering, manufacturing, and supply-chain teams to translate reliability data into action that drives product success.
Communicate results to technical and business stakeholders, influencing technology roadmaps and qualification decisions.
Qualifications
We're looking for a highly motivated engineer or scientist who is excited by the challenge of developing and qualifying the advanced packaging and integration technologies that power Keysight's industry-leading measurement solutions.
This role is ideal for candidates with expertise in advanced packaging, interposer, and interconnect reliability, and a passion for understanding how complex heterogeneous systems perform over long operating lifetimes.
Required Qualifications
This role requires a combination of practical hands-on experience, academic rigor, and analytical skills.
B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field (or equivalent industry experience).
Candidates must have proven experience in the following areas
Experience with advanced packaging, interposer, and heterogeneous integration technologies.
Understanding of the physical mechanisms that influence long-term package and interconnect reliability.
Experience developing and executing package reliability qualification plans and accelerated stress methodologies.
Knowledge of degradation mechanisms including: thermomechanical fatigue, intermetallic compound growth, electromigration, stress migration, CTE mismatch-induced failures, delamination, moisture-induced failures, wire bond and flip-chip degradation, TSV, micro-bump, hybrid bond, and interposer failure mechanisms
Experience with environmental and mechanical reliability testing such as: temperature cycling, thermal shock, highly accelerated stress testing (HAST) temperature-humidity-bias (THB), power cycling, mechanical shock and vibration
Familiarity with reliability modeling methods used for package and interconnect lifetime prediction.
Strong background in probability, statistics, and data analysis, with the ability to extract insights from complex reliability datasets.
Excellent analytical and problem-solving skills, including root-cause investigation and failure mechanism identification.
Effective communication and interpersonal skills, enabling productive collaboration across multidisciplinary engineering teams and external suppliers.
A high level of ownership, accountability, initiative, and self-motivation, with a proactive approach to driving technical outcomes.
Preferred Qualifications
Knowledge of high-frequency packaging and interconnect technologies used in RF, microwave, and millimeter-wave products.
Experience with finite element analysis (FEA), thermomechanical modeling, or reliability simulation tools.
Familiarity with materials used in advanced packaging, including underfills, molding compounds, die attach materials, substrates, and interconnect metallurgies.
Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
Experience with package failure analysis techniques including cross-sectioning, SAM, SEM, FIB, dye-and-pry, X-ray, and related methods.
What Sets Exceptional Candidates Apart
Deep expertise in advanced package, interposer, and interconnect reliability.
The ability to connect materials science, mechanical behavior, reliability physics, and statistical analysis to solve complex engineering problems.
Experience qualifying emerging heterogeneous integration technologies.
Curiosity and enthusiasm for working on technologies operating at the forefront of RF, microwave, millimeter-wave, and advanced package integration performance.
A passion for understanding how advanced packages and interconnect architectures work and why they fail.
A desire to influence the qualification and deployment of the technologies that directly enable Keysight's next generation of differentiated products.
This role is ideal for engineers who enjoy combining deep technical analysis, cutting-edge packaging technologies, and data-driven decision making to ensure the long-term success of breakthrough products. You will have the opportunity to evaluate the reliability of technologies that directly contribute to Keysight's product differentiation and performance leadership in the Test & Measurement industry.
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.
The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.
Santa Rosa, CA MIN $138,960.00- MID $185,280.00- MAX $231,600.00
Note: For other locations, pay ranges will vary by region
This role is eligible for Keysight Results Bonus Program
US Employees may be eligible for the following benefits
Medical, dental and vision
Health Savings Account
Health Care and Dependent Care Flexible Spending Accounts
Life, Accident, Disability insurance
Business Travel Accident and Business Travel Health
401(k) Plan
Flexible Time Off, Paid Holidays
Paid Family Leave
Discounts, Perks
Tuition Reimbursement
Adoption Assistance
ESPP (Employee Stock Purchase Plan)
#LI-MED1
Reliability Engineer – Advanced Package, Heterogenous Integration, Interposer Technologies
Join a team at the forefront of semiconductor innovation, enabling the breakthrough technologies that differentiate Keysight's industry-leading design enablement solutions. As a Reliability Engineer, you will work hands-on with some of the world's most high-performance interconnect technologies that power next-generation RF, microwave, millimeter-wave, and high-speed digital products.
In this role, you will play a critical part in ensuring that cutting-edge technologies meet the demanding performance, quality, and lifetime expectations of Keysight customers. You will collaborate closely with device engineers, process technologists, product designers, and manufacturing teams to evaluate, qualify, and continuously improve the technologies that form the foundation of Keysight's product leadership. If you are excited by advanced semiconductor technology, data-driven problem solving, and the challenge of ensuring reliability in products operating at the leading edge of performance, this role offers an opportunity to make a visible and lasting impact.
What You'll Do
Design, develop, and execute reliability qualification strategies for advanced packaging, heterogeneous integration, interposer technologies, and high-performance interconnect solutions.
Evaluate emerging packaging and integration technologies, ensuring they meet the stringent reliability requirements of high-performance Test & Measurement applications.
Investigate package- and interconnect-level degradation mechanisms and develop qualification methodologies that accurately predict field performance and lifetime.
Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions.
Build and expand package reliability characterization infrastructure, enabling rapid assessment of new technologies while supporting future growth in capability and test capacity.
Partner with technology development, product engineering, manufacturing, and supply-chain teams to translate reliability data into action that drives product success.
Communicate results to technical and business stakeholders, influencing technology roadmaps and qualification decisions.
We're looking for a highly motivated engineer or scientist who is excited by the challenge of developing and qualifying the advanced packaging and integration technologies that power Keysight's industry-leading measurement solutions.
This role is ideal for candidates with expertise in advanced packaging, interposer, and interconnect reliability, and a passion for understanding how complex heterogeneous systems perform over long operating lifetimes.
Required Qualifications
This role requires a combination of practical hands-on experience, academic rigor, and analytical skills.
B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field (or equivalent industry experience).
Candidates must have proven experience in the following areas
Experience with advanced packaging, interposer, and heterogeneous integration technologies.
Understanding of the physical mechanisms that influence long-term package and interconnect reliability.
Experience developing and executing package reliability qualification plans and accelerated stress methodologies.
Knowledge of degradation mechanisms including: thermomechanical fatigue, intermetallic compound growth, electromigration, stress migration, CTE mismatch-induced failures, delamination, moisture-induced failures, wire bond and flip-chip degradation, TSV, micro-bump, hybrid bond, and interposer failure mechanisms
Experience with environmental and mechanical reliability testing such as: temperature cycling, thermal shock, highly accelerated stress testing (HAST) temperature-humidity-bias (THB), power cycling, mechanical shock and vibration
Familiarity with reliability modeling methods used for package and interconnect lifetime prediction.
Strong background in probability, statistics, and data analysis, with the ability to extract insights from complex reliability datasets.
Excellent analytical and problem-solving skills, including root-cause investigation and failure mechanism identification.
Effective communication and interpersonal skills, enabling productive collaboration across multidisciplinary engineering teams and external suppliers.
A high level of ownership, accountability, initiative, and self-motivation, with a proactive approach to driving technical outcomes.
Preferred Qualifications
Knowledge of high-frequency packaging and interconnect technologies used in RF, microwave, and millimeter-wave products.
Experience with finite element analysis (FEA), thermomechanical modeling, or reliability simulation tools.
Familiarity with materials used in advanced packaging, including underfills, molding compounds, die attach materials, substrates, and interconnect metallurgies.
Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
Experience with package failure analysis techniques including cross-sectioning, SAM, SEM, FIB, dye-and-pry, X-ray, and related methods.
What Sets Exceptional Candidates Apart
Deep expertise in advanced package, interposer, and interconnect reliability.
The ability to connect materials science, mechanical behavior, reliability physics, and statistical analysis to solve complex engineering problems.
Experience qualifying emerging heterogeneous integration technologies.
Curiosity and enthusiasm for working on technologies operating at the forefront of RF, microwave, millimeter-wave, and advanced package integration performance.
A passion for understanding how advanced packages and interconnect architectures work and why they fail.
A desire to influence the qualification and deployment of the technologies that directly enable Keysight's next generation of differentiated products.
This role is ideal for engineers who enjoy combining deep technical analysis, cutting-edge packaging technologies, and data-driven decision making to ensure the long-term success of breakthrough products. You will have the opportunity to evaluate the reliability of technologies that directly contribute to Keysight's product differentiation and performance leadership in the Test & Measurement industry.
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.
The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.
Santa Rosa, CA MIN $138,960.00- MID $185,280.00- MAX $231,600.00
Note: For other locations, pay ranges will vary by region
This role is eligible for Keysight Results Bonus Program
US Employees may be eligible for the following benefits
Medical, dental and vision
Health Savings Account
Health Care and Dependent Care Flexible Spending Accounts
Life, Accident, Disability insurance
Business Travel Accident and Business Travel Health
401(k) Plan
Flexible Time Off, Paid Holidays
Paid Family Leave
Discounts, Perks
Tuition Reimbursement
Adoption Assistance
ESPP (Employee Stock Purchase Plan)
#LI-MED1
