Responsibilities
Collaborate with design teams to define packaging architectures and integration strategies.
Develop design rules and guidelines for manufacturability and reliability.
Evaluate new materials, interconnect technologies, and advanced packaging concepts.
Perform feasibility studies and risk assessments for new designs.
Partner with process and integration engineering and manufacturing teams to ensure smooth technology transfer.
Support prototype builds and analyze performance data to refine design approaches.
Drive innovation and lead projects in heterogeneous integration and advanced packaging for emerging markets like 6G.
Drive technical and business process optimizations to meet Key Performance Indicators (KPI) targets and metrics.
Manage multiple priorities, assess risks and tradeoffs, propose and implement solutions to mitigate risks.
Regularly report progress and risks to cross-functional partners and upper management.
Qualifications
B.S., M.S., or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field
Must have 3+ years of applicable semiconductor manufacturing industry experience (applicable internship/lab work/research experience will be considered)
Strong analytical and problem-solving skills
Ability to collaborate effectively across design, process, and manufacturing teams
Excellent communication skills for technical discussions and cross-functional alignment
Preferred Expertise
Semiconductor packaging design and integration
Design for manufacturing and reliability
Advanced interconnect technologies (flip-chip, thermocompression bonding)
Materials science for packaging applications
Statistical analysis and design of experiments (DOE)
Familiarity with SiP (System in Package), SMT, and heterogeneous integration
Candidates must be local or willing to relocate to Santa Rosa, CA
This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.
Santa Rosa, CA Pay Range: MIN $126,930.00 - MID $169,240 MAX $211,550
Note: For other locations, pay ranges will vary by region.
This role is eligible for Keysight Results Bonus Program and US Employees may be eligible for the following benefits:
Medical, dental and vision
Health Savings Account
Health Care and Dependent Care Flexible Spending Accounts
Life, Accident, Disability insurance
Business Travel Accident and Business Travel Health
401(k) Plan
Flexible Time Off, Paid Holidays
Paid Family Leave
Discounts, Perks
Tuition Reimbursement
Adoption Assistance
ESPP (Employee Stock Purchase Plan)
#LI-MED1
This role emphasizes design enablement and advanced packaging architecture, working closely with upstream design teams. It differs from the Advanced Packaging role, which focuses on manufacturing execution and process development. Both roles collaborate closely on the same team but have distinct responsibilities.
Join our team to drive development and industrialization of advanced packaging technologies for next-generation System-in-Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight, serving multiple industries such as wireless communications, aerospace, and automotive. This role is at the intersection of design development and process innovation, with a strong emphasis on heterogeneous integration—bringing together diverse semiconductor technologies into a single, high-performance package.
Responsibilities
Collaborate with design teams to define packaging architectures and integration strategies.
Develop design rules and guidelines for manufacturability and reliability.
Evaluate new materials, interconnect technologies, and advanced packaging concepts.
Perform feasibility studies and risk assessments for new designs.
Partner with process and integration engineering and manufacturing teams to ensure smooth technology transfer.
Support prototype builds and analyze performance data to refine design approaches.
Drive innovation and lead projects in heterogeneous integration and advanced packaging for emerging markets like 6G.
Drive technical and business process optimizations to meet Key Performance Indicators (KPI) targets and metrics.
Manage multiple priorities, assess risks and tradeoffs, propose and implement solutions to mitigate risks.
Regularly report progress and risks to cross-functional partners and upper management.
B.S., M.S., or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field
Must have 3+ years of applicable semiconductor manufacturing industry experience (applicable internship/lab work/research experience will be considered)
Strong analytical and problem-solving skills
Ability to collaborate effectively across design, process, and manufacturing teams
Excellent communication skills for technical discussions and cross-functional alignment
Preferred Expertise
Semiconductor packaging design and integration
Design for manufacturing and reliability
Advanced interconnect technologies (flip-chip, thermocompression bonding)
Materials science for packaging applications
Statistical analysis and design of experiments (DOE)
Familiarity with SiP (System in Package), SMT, and heterogeneous integration
Candidates must be local or willing to relocate to Santa Rosa, CA
This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.
Santa Rosa, CA Pay Range: MIN $126,930.00 - MID $169,240 MAX $211,550
Note: For other locations, pay ranges will vary by region.
This role is eligible for Keysight Results Bonus Program and US Employees may be eligible for the following benefits:
Medical, dental and vision
Health Savings Account
Health Care and Dependent Care Flexible Spending Accounts
Life, Accident, Disability insurance
Business Travel Accident and Business Travel Health
401(k) Plan
Flexible Time Off, Paid Holidays
Paid Family Leave
Discounts, Perks
Tuition Reimbursement
Adoption Assistance
ESPP (Employee Stock Purchase Plan)
#LI-MED1
