Responsibilities
Contribute to mechanical and electro-mechanical design for Keysight’s next-generation quantum control systems, from early concepts through production release.
Participate in the development of high-density mechanical platforms designed for HPC/datacenter environments, including rack-ready enclosures, modular assemblies, and service-friendly designs.
Support the development of thermal management solutions—including liquid cooling, airflow optimization, heat exchangers, heat pipes, and cold plates—for high-power, high-channel-count control electronics.
Perform engineering analyses (thermal, structural, airflow, manufacturability) and provide input to guide design decisions.
Create 3D CAD models, engineering drawings, and documentation following ANSI standards.
Assist with validation and verification activities, including prototype testing for thermal performance, vibration, and long-term reliability.
Work closely with electrical, RF/uW, FPGA, firmware, and software teams to ensure smooth integration across all system elements.
Collaborate with internal and external manufacturing teams to support DFM, DFT, assembly processes, and supplier engagement.
Research new materials, fabrication methods, and mechanical technologies that can improve performance, manufacturability, or cost.
Contribute to long-term mechanical design strategies for scalable quantum control product development.
Qualifications
Requirement
BS degree in Mechanical Engineering or related field
Proficiency with 3D CAD tools (Siemens NX preferred) and familiarity with ANSI drafting standards.
Ability to perform mechanical or thermal simulations (NX Flow or similar is a plus).
Strong communication skills and ability to collaborate across disciplines in a fast-paced R&D environment.
Fluency in both Japanese and English (written and spoken) is required to collaborate effectively with local teams and global R&D groups.
Highly organized, detail-oriented, and eager to contribute to advanced technology development.
Preferred
MS degree preferred.
Experience in electro-mechanical design, electronics packaging, or complex mechanical systems (experience with high-density or rack-mounted systems is a plus).
Knowledge of thermal management methods such as airflow design, liquid cooling, heat pipes, cold plates, or related technologies.
Familiarity with common fabrication processes (sheet metal, machined parts, plastics, extrusions).
Experience transferring designs to manufacturing engineers and supporting production.
Familiarity with HPC/datacenter equipment, server packaging, networking hardware, or industrial electronics is helpful but not required.
Hands-on prototyping and debugging skills; comfortable using common bench tools and test equipment.
Experience with reliability and environmental testing (thermal cycling, vibration, shock) is a plus.
Candidates who meet many—but not necessarily all—of the above qualifications are encouraged to apply.
We value strong mechanical engineering fundamentals, willingness to learn, and the ability to grow into the full scope of the role.
Contribute to mechanical and electro-mechanical design for Keysight’s next-generation quantum control systems, from early concepts through production release.
Participate in the development of high-density mechanical platforms designed for HPC/datacenter environments, including rack-ready enclosures, modular assemblies, and service-friendly designs.
Support the development of thermal management solutions—including liquid cooling, airflow optimization, heat exchangers, heat pipes, and cold plates—for high-power, high-channel-count control electronics.
Perform engineering analyses (thermal, structural, airflow, manufacturability) and provide input to guide design decisions.
Create 3D CAD models, engineering drawings, and documentation following ANSI standards.
Assist with validation and verification activities, including prototype testing for thermal performance, vibration, and long-term reliability.
Work closely with electrical, RF/uW, FPGA, firmware, and software teams to ensure smooth integration across all system elements.
Collaborate with internal and external manufacturing teams to support DFM, DFT, assembly processes, and supplier engagement.
Research new materials, fabrication methods, and mechanical technologies that can improve performance, manufacturability, or cost.
Contribute to long-term mechanical design strategies for scalable quantum control product development.
Requirement
BS degree in Mechanical Engineering or related field
Proficiency with 3D CAD tools (Siemens NX preferred) and familiarity with ANSI drafting standards.
Ability to perform mechanical or thermal simulations (NX Flow or similar is a plus).
Strong communication skills and ability to collaborate across disciplines in a fast-paced R&D environment.
Fluency in both Japanese and English (written and spoken) is required to collaborate effectively with local teams and global R&D groups.
Highly organized, detail-oriented, and eager to contribute to advanced technology development.
Preferred
MS degree preferred.
Experience in electro-mechanical design, electronics packaging, or complex mechanical systems (experience with high-density or rack-mounted systems is a plus).
Knowledge of thermal management methods such as airflow design, liquid cooling, heat pipes, cold plates, or related technologies.
Familiarity with common fabrication processes (sheet metal, machined parts, plastics, extrusions).
Experience transferring designs to manufacturing engineers and supporting production.
Familiarity with HPC/datacenter equipment, server packaging, networking hardware, or industrial electronics is helpful but not required.
Hands-on prototyping and debugging skills; comfortable using common bench tools and test equipment.
Experience with reliability and environmental testing (thermal cycling, vibration, shock) is a plus.
Candidates who meet many—but not necessarily all—of the above qualifications are encouraged to apply.
We value strong mechanical engineering fundamentals, willingness to learn, and the ability to grow into the full scope of the role.
