Responsibilities include
Develop and own structural FEA simulation capabilities to support multiple ongoing NPI projects as well as sustaining issues as they arise
Improve simulation accuracy continuously through test correlation and model refinement
Maintain and coordinate multiple FEA projects done by yourself, other internal functions, as well as external partners
Drive and review FEA simulation efforts by component suppliers and ODMs
Participate from Concept phase to provide design guidance by running FEA studies on areas of concern
Act as the main point of contact for all mechanical-related issues that arise from MDVT and HALT and lead issue resolution by validating design changes through simulation and/or test
Design and prototype chassis and fixture for testing
Become the in-house expert in strain gauge applications and accelerometer measurements during MDVT and HALT
Conduct thorough processing and analysis of test data including microstrain, G-levels, and ASIC temperatures throughout MDVT and HALT
Document tests and FEA simulations, including static loading, modal analysis and dynamic, in each NPI project’s design review and be responsible for the system’s structural integrity
Communicate recommended design changes effectively to HW leads with strong justification backed by FEA model results
Collaborate with ASIC development team to generate 3D models of ASICs based on package outline drawings including BGAs and conduct near-package or co-package connector placement and floorplan studies as required
Support manufacturing and operations’ efforts to improve production yield by performing FEA studies or running limited design of experiments in lab
Provide mechanical design and structural analysis support across multiple product development programs, including chassis design, packaging, reliability, and manufacturability.
Participate in hands-on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root-cause investigations.
Collaborate with cross-functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions.
Contribute to mechanical specifications, design guidelines, validation plans, and engineering best practices.
Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.
Required
10+ years of experience in electromechanical product development.
MS in Mechanical Engineering, Applied Physics or equivalent.
Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
Experience in FEA and familiarity with ANSYS Workbench, including static-structural, modal analysis, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal, are necessary
Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, and structural analysis techniques.
Expected Competencies
Expert-level proficiency with 3D solid modeling tools; SolidWorks experience preferred. Working knowledge of EPDM or equivalent PLM systems is a plus.
Experience in LS-Dyna and response spectrum analysis are highly desired but not necessary
Experience in meshing sheet metal geometries as solid or as shell elements and working knowledge of defeaturing non-structural elements to simplify mesh
Good structural intuition of load path in a mechanical design
Strong and proven ability to break complex system design down to a sub-system in order to simplify FEA setup and runtime
Familiarity with test standards including GR-63, IPC-9704, and ASTM D4169
Strong working knowledge of Young’s modulus (E) and coefficients of thermal expansion (CTEs) of common materials used in ASIC and cooling components
Experience in modeling of die warpage due to thermal effects and with heatsink loading is highly desired
Previous training with strain gauge applications on PCB and data analysis involving principal microstrain, as well as strain rate, is highly desired
Experience with accelerometer G-value data filtering and analysis from dynamic tests such as vibration and shockdoes
Proven hands-on experience in dynamic testing
Knowledge of dye-and-pry, Shadowmoire, operation of 3D-scanning metrology equipment
Extensive experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products.
Experience with ECAD-MCAD integration and IDF workflows.
Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes.
Strong understanding of tooling requirements and manufacturing considerations for volume production.
Strong understanding of NEBS, EMI, EMC, Safety, and other regulatory compliance requirements.
Proven ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments.
Experience leading root-cause investigations and implementing corrective actions.
Excellent communication and leadership skills with the ability to influence cross-functional teams.
Comprehensive understanding of the complete product development lifecycle from concept through production and field support.
Accessibility
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Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.
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Job
- Engineering
- Job Level:
- TCP_05
- The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level.
- United States of America: Annual Salary USD 140,500 - 285,000 in California
- The listed salary range reflects base salary. Variable incentives may also be offered.
Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html
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