Qualification Strategy: Lead Installation Qualification, Module Operational Qualification, Measurement System Analysis, HVM and Transfer Qualification, Reliability Validation, Change Qualification, and production release reviews.
Module Manufacturing Qualification: Ensure test processes achieve quality, yield, miscorrelation, gain, capability, stability, cost, and customer-risk objectives before transfer and during ramp.
Technology Transfer and Factory Support: Enable successful and timely transfer to ATM factories; provide effective IPG QRE support for engineering, qualification, pilot, and revenue production.
Methodology Ownership: Own, define, and update Test Process Certification methods, specifications, critical success indicators, qualification templates, and release criteria.
QMS Deployment: Establish and maintain FMEA, Control Plans, MSA, SPC, OCAP, calibration, traceability, data integrity, change control, work instructions, and audit-ready evidence.
Excursion and Corrective Action Leadership: Lead MQE, excursion, yield, hardware, and reliability investigations using 8D, 5 Why, fault isolation, DOE, and model-based problem solving; verify corrective action effectiveness and recurrence prevention.
Analytics and Continuous Improvement: Use statistical analysis and manufacturing data to monitor process health, predict emerging risk, reduce escapes, improve qualification efficiency, and strengthen certification decisions.
Qualifications
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, research, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications
Bachelor's degree with 4+ years of relevant experience, OR Master's degree with 3+ years of relevant experience, OR PhD in Mechanical Engineering, Materials Science, Metallurgy, Chemical Engineering, Electrical Engineering, Chemistry, Physics, Reliability Engineering, or a related technical field.
Relevant Experiences Include
Experience in one or more of the following: test process development, product development, HVM factory operations, semiconductor manufacturing, product test methodology and standards, die preparation, SORT/SDx, hardware development, reliability engineering, failure analysis, or process certification.
Demonstrated ability to lead risk assessments, qualification plans, corrective actions, readiness reviews, technical decisions, and cross-functional execution.
Strong statistical, analytical, written, and verbal communication skills, including the ability to translate technical risk into clear actions and decisions.
Preferred Qualifications
Semiconductor Test and Flow
Wafer sort, die sort, final test, burn-in, SLT, HDMT/AHMT, V93K/Advantest
Die prep, probing, package assembly, back-end test, and end-to-end material flow from silicon fab to customer
Test Process Definition, Test Process Certification, ATTD development, HVM transfer, and ATM excursion management
Identify electrical, thermal, mechanical, contamination, ESD, and test-induced product risks.
Define mitigation plans and closure criteria.
Ensure risks are tracked through development, qualification, and production ramp.
Quality, Reliability and Analytics
FMEA, Control Plan, SPC, OCAP, 8D, DOE, reliability validation, and change control
Electrical, thermal, mechanical, contamination, ESD, and test-induced product risk assessment
JMP/JSL, SQL, statistical modeling, process capability, correlation, and predictive monitoring
Advanced packaging, foundry manufacturing, supplier quality, and ODM manufacturing systems
Take advantage of this opportunity to join Intel and shape the future of engineering. Apply today to be part of a team that drives industry-leading innovation and transformation.
Interview Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location
US, Oregon, Hillsboro
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Work Model for this Role
- This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
