Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
Establish criteria and methods to determine proper inputs and validate results.
Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
Document technical solutions and present findings to project stakeholders.
Qualifications
Minimum Qualifications
Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
Must have a minimum of a 3.0 GPA in college courses to date.
1+ year experience programming in C/C++/Python or equivalent.
Strong analytical, problem-solving, and software development skills.
Preferred Qualifications
Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.
Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.
Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.
This is your opportunity to develop your expertise, gain hands-on experience, and make a meaningful impact within a collaborative environment that drives the future of technology. We look forward to seeing how your skills and passion will contribute to our innovative team.
Job Type
Student / Intern
Shift
Shift 1 (United States of America)
Primary Location
US, Oregon, Hillsboro
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $149,598.00-149,602.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
- Work Model for this Role
- This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
