Experimental Characterization (DOE): Design and execute experimental plans using Design of Experiments (DOE) principles to characterize process windows and analyze complex material and equipment interactions.
Data Analytics & Process Modeling: Apply statistical methods, deep data analytics, and engineering scripting tools to optimize manufacturing processes, drive material enhancements, and resolve IC substrate development challenges.
Continuous Improvement: Implement continuous process improvements to enhance tool stability, product quality, and manufacturing productivity.
Cross-Functional Problem Solving: Partner with cross-functional engineering, materials, and equipment teams to drive process development and root-cause troubleshooting initiatives.
Technical Documentation & Transfer: Author technical documentation, including white papers and process specifications, to enable seamless technology transfer and knowledge sharing across global teams.
As a Successful Candidate, You Will Bring
Technical Leadership & Influence: Strong leadership skills to guide cross-functional engineering efforts and drive technical alignment across diverse teams.
Analytical Problem Solving: Deep analytical mindset with a passion for combining empirical data and theoretical modeling to solve complex materials and processing challenges.
Clear Technical Communication: Concise written and verbal communication style to author specifications, publish internal white papers, and present findings to stakeholders.
Adaptability & Ownership: Self-directed engineer who thrives in a dynamic R&D environment and takes full accountability for project milestones.
Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take ownership of next-generation materials and processes, collaborate with world-class scientists, and build a rewarding engineering career.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.
Minimum Qualifications
Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or a related field, with 6+ years of related experience; OR
Master's degree in the above fields, with 4+ years of related experience; OR
PhD in the above fields, with 2+ years of related experience.
Relevant experience can be any of the following
Design of Experiments (DOE), statistical data analysis, and process control tools.
Understanding of IC substrate and/or advanced packaging processing principles.
Engineering programming tools like JMP, Python, MATLAB, or similar software for process modeling and/or data analysis.
Preferred Qualifications
3+ years of experience in
Dielectric materials formulation (structure/property relations expertise) and/or processing.
Finite Element Analysis (FEA) modeling tools such as COMSOL, Ansys, etc.
Machine learning or artificial intelligence applications for engineering scenarios.
Designing experimental setups to validate modeling and simulation outputs.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location
US, Arizona, Phoenix
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Work Model for this Role
- This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
