Qualifications
Master's degree with 1 to 2 years of relevant experience or
PhD in Mechanical Engineering with expertise in CFD or FEA, and experience in design parametric studies and electronic packaging. Fresh graduates are encouraged to apply.
Proficiency in Fluent, Ansys, Abaqus, Python, MATLAB, and VS Code for analysis tool automation and AI integration.
Familiarity with design of experiments (DOE) and materials characterization techniques.
Fundamental understanding of flip-chip and advanced packaging anatomy and assembly processes.
Strong communication and collaborative problem-solving skills.
Experience in external collaborations and academic mentorship.
Hands-on research capability with disciplined execution and clear research vision.
Job Type
Experienced Hire
Shift
Shift 1 (Malaysia)
Primary Location
Malaysia, Kulim
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
- Work Model for this Role
- This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
