Work closely with mechanical designers to define heat spreaders for optimal performance
Deliver and disseminate design milestones to stakeholders
Communicate designs in presentations and relevant documentation
Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers
As a successful candidate, you must possess
Excellent communication and presentation skills for technical and non-technical audiences
Strong analytical thinking and problem-solving capabilities
Collaborative mindset with ability to work effectively across diverse teams
Adaptability to work in a fast-paced, innovative research environment
Passion for pushing the boundaries of quantum technology development
Join Intel's Quantum Computing Group where we are building the future of quantum computing. If you're passionate about working at the forefront of quantum computing packaging and want to work with the resources and expertise of the world's leading semiconductor company, we want to hear from you. Apply today and discover your place in our world-changing work.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of relevant industry job experience, internship experience and/or schoolwork/classes/research.
Minimum Qualifications
M.S. degree in Electrical Engineering, Physics or related field AND 5+ years of experience in in Thermal modeling and simulation for packaging, or other related hardware.
OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.
The experience must include
Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related.
Understanding of packaging technologies and thermal integration.
Preferred Qualifications
2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location
US, Oregon, Hillsboro
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Work Model for this Role
- This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
