Qualifications
Bachelor's degree or Master's degree in Mechanical Engineering, Mechatronics, Automation Control, Electronics, Data Science, Materials Science & Engineering, Metallurgy, Chemical Engineering or a related physical science/engineering discipline.
Minimum 1–3 years of experience in semiconductor packaging, electronics manufacturing, or high-volume Surface Mount Technology (SMT) assembly environments.
Proficient in both spoken and written English communication.
Working knowledge of BGA package assembly and SMT manufacturing processes.
Experience in yield improvement, quality engineering, and manufacturing problem-solving.
Knowledge of BGA package assembly and SMT manufacturing processes.
Knowledge of FMEA, PFMEA, Control Plans, SPC, and corrective/preventive action methodologies.
Knowledge of data analysis tools, scripting and programing such as JMP, SQL, Power BI, Python.
Strong troubleshooting, analytical, and root-cause investigation skills.
Ability to work effectively across multiple engineering disciplines and manufacturing organizations.
Additional preferred qualifications include
Experience supporting automated inspection systems and vision-based manufacturing equipment.
Familiarity with quality methodologies such as Six Sigma, DMAIC, 8D, FMEA, and Statistical Process Control.
Experience driving yield improvement projects in semiconductor or electronics manufacturing.
You bring relevant experience in one or more of the following areas
Hands-on experience sustaining automated optical inspection, visual inspection, or automated manufacturing equipment.
Hands-on experience sustaining, programming, and troubleshooting -automated stencil printing systems, 3D Solder Paste Inspection (SPI), multizone reflow ovens, and aqueous/chemical deflux cleaning modules.
Process Metallurgy & Joint Reliability: Working knowledge of BGA package assembly, lead-free solder metallurgy (SAC alloys, low-temperature Bismuth), intermetallic compound (IMC) growth control, and package warpage due to Coefficient of Thermal Expansion (CTE) mismatch.
