Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance.
Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line.
Level of experience will be considered in determining applicants job grade.
Qualifications
Skills Required
Problem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solution paths.
Teamwork and Partnership: Strong teamwork skills and the ability to build effective partnerships.
Communication: Excellent written and verbal communication skills, with the ability to summarize and communicate information effectively to influence action at all levels.
Self-Motivation: A motivated self-starter with the ability to work independently as well as collaboratively in a team environment.
Flexibility: Maturity and adaptability in facing uncertainties and changing priorities or responsibilities.
Goal Commitment: Commitment to achieving aggressive goals with a positive, can-do attitude and ability to act with velocity and a strong sense of urgency.
Qualifications
Minimum Qualifications
Relevant Bachelors, Masters and/or a PhD degree in Device physics, Electronics, physics chemistry or related technical field.
5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration.
5-10 years' experience in FinFET technology development or high-volume manufacturing.
5-10 years' experience with Device Physics and hands-on application in real-world fab environment.
Preferred Qualifications
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major.
Experience driving product performance roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products.
Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.
Demonstrated interpersonal skills including influencing, engaging, and motivating.
Experience in serving external Foundry customers through technical interactions.
Experience in GAA (Gate-All-Around) technology architecture.
Experience in new semiconductor technology development.
Basic understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.
Job Type
Experienced Hire
Shift
Shift 1 (Ireland)
Primary Location
Ireland, Leixlip
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
EU Salary
We offer a total compensation package that ranks among the best in the industry. Annual Salary Range for this job which could be performed in Ireland is: 85,700.00 € - 133,900.00 €

The compensation range displayed in this posting reflects the minimum and maximum target compensation for this position. Within this range, individual pay is determined by job related skills, experience, and relevant education, training. As part of our total compensation approach, the final offer may include additional pay components and benefits. Your recruiting team will share the confirmed base salary along with any applicable total compensation elements upon employment offer delivery.
- Work Model for this Role
- This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
