Collaborate with equipment and material suppliers to design and implement innovative process technologies.
Develop technology roadmaps to guide future manufacturing needs and set industry standards.
Monitor production efficiency and recommend modifications to improve scalability and output.
Utilize statistical process control and data analytics to ensure process stability and continuous improvement.
Partner with cross-functional teams to align on process integration and project deliverables.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience.
OR PhD in the same fields with 2+ years of relevant experience.
2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control or manufacturing process improvements.
Preferred Qualifications
Strong technical expertise in areas such as plasma etch, plating processes, or thin-film deposition.
Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
Demonstrated success in leading programs from strategy formation to high-volume production.
Strong collaboration skills with cross-functional teams, including yield, operations, and supplier management.
Ability to solve complex engineering challenges and drive innovative solutions that align with Intel's strategic goals.
Job Type
Experienced Hire
Shift
Shift 1 (United States of America)
Primary Location
US, Oregon, Hillsboro
Additional Locations
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
- Work Model for this Role
- This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
