Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
Act as a key interface to partners and technical consultants on package definition, particularly for Back-End assembly technology expertise.
Support pre-development and project definition activities and remain the packaging design expert throughout the full project lifecycle.
- Your profile
- Qualifications and skills to help you succeed
Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.
Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
Working knowledge of SMT and PCB/module-related technologies.
Expertise in semiconductor packaging, assembly, and test.
Working knowledge on flip/chip process, package/strip grinding, molding
Experience with failure analysis and reliability engineering.
Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
AutoCAD and 3D drafting skills preferred.
Excellent communication and presentation skills, must be able to communicate effectively English ( Mandarin is a plus), both verbally and in writing.
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?
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