Core Responsibilities
Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.
Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.
Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.
Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.
Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.
Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.
Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.
Required Qualifications and Skills
Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.
Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.
Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.
Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.
Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.
Preferred Qualifications
Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.
Experience standing up a new engineering team or site, including recruiting and onboarding at scale.
Familiarity with liquid-cooled AI system design and rack-level integration.
Experience operating across US and Taiwan engineering teams
Compensation: $162K to $220K DOE
What’s in it for you
Benefit Insurance
Flexible Spending Account (FSA)
Health Savings Account (HSA)
Mental Health Care
401K with match
Paid Holidays, Vacation & Sick Days
Tuition Reimbursement
Perks at Work
LEAP Program
MyFlexPay
We are an Equal Opportunity Employer and do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability, or any other legally protected status. We are committed to creating an inclusive environment for all employees.
