PRIMARY RESPONSIBILITIES
{E} Essential Functions {NE} Non-Essential Functions
Day-to-Day responsibilities include completing assigned tasks in a timely fashion, developing good customer relations through calls, and emails, troubleshooting customer process issues, working closely with the customer to understand needs and reporting back to SED; as well as managing and driving projects to closure. {E}
Perform hands-on RIE/dry etch process troubleshooting and development. This includes performing troubleshooting and demonstrations at the customer site, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. {E}
Utilize analytical tools and techniques to solve process implementation issues. {E}
Heavy use of data, analysis, design, and execution of experiments including DOE and working with code or developed code for the analysis of data. {E}
After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including scanning electron microscopy, and critical dimension scanning electron microscopy. {E}
Generate internal and external documentation for products, presentations, technical reports, and process engineering specifications. {E}
Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues. {E}
EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS
BS Degree in Chemical Engineering, Materials Science, Engineering Physics, semiconductor related field, or equivalent experience.
EXPERIENCE AND TRAVEL REQUIREMENTS
0-2 years Plasma Etch Process Experience or semiconductor processing preferred. {NE}
Data analysis and high level of proficiency in Microsoft Excel are needed. {E}
Travel to field offices in Texas for assignments in 3-6 month intervals. {E}Must be able to travel to Asia for training assignment. {E}
Periodic oversees business trips may be required throughout the year. {E}
SKILLS AND ABILITIES REQUIREMENTS & SAFETY REQUIREMENTS
Strong general technical knowledge of semiconductor wafer processing.
Fundamental understanding of and experience with Dry Etch / RIE.
Self-motivated and show ability to adapt to changes in a fast-moving environment.
Strong knowledge of chemistry, the ability to analyze OES data, equipment data (IE) and utilize other predictive software is required.