Specify, bring up, and qualify required clean room equipment and advanced metrology capabilities, establishing baseline operational recipes and documentation.
Drive process integration activities around wafer thinning, thin-wafer handling, and stress/warp mitigation.
Coordinate vendor evaluations, off-site demos, technology transfers, and Release to Production of tools and processes into quantum device production processes.
Troubleshoot processing anomalies, improve yield, and train cleanroom personnel and technicians on standard operating procedures.
Minimum qualifications
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment.
3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes.
Preferred qualifications
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience mitigating mechanical stress, bow, warp, and micro-cracking in ultra-thin silicon substrates, integrated with backside thinning and dicing-on-tape workflows.
Experience executing 3D Integration technical roadmaps, executing complex development and process integration projects.
Excellent collaborative leadership skills, and experience leading technical evaluations with equipment vendors, managing joint development projects, and cross-training/mentoring engineers and technicians.
Expertise in polymer adhesives, temporary bonding materials, and release processes.
Ownership qualifying automated temporary bonding, lamination, and laser/mechanical debonding tools.
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment.
3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes.
