Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $132000 - $189000 (USD) + 15% bonus target + equity + benefits
Learn more about benefits at Google.
Support Advanced Manufacturing Engineers in developing, defining, and qualifying industry-first manufacturing processes.
Plan and implement innovative processes into established production and capacity workflows to hit forecast targets.
Create critical manufacturing documentation, including Bills of Materials (BOM), assembly drawings, and work instructions.
Establish and maintain manufacturing and quality standards for new technologies using existing tools.
Collaborate with design teams and manufacturing partners on Design for Excellence (DfX), build readiness, and solve design/process challenges for NPI launches
Minimum qualifications
Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
2 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology.
Experience with development of PCBA manufacturing processes including acceptance testing, startup, and qualification.
Experience in new site/line/equipment bring-up/transfer and qualification for PCBA and system integration.
Preferred qualifications
Master’s degree in Mechanical, Industrial, or Electrical Engineering, or a related discipline.
Experience with Product Data Management (PDM) tools (e.g., SAP, Agile, Windchill).
Experience developing solid, effective technical relationships with contract manufacturers and vendors.
Experience in SMT manufacturing and process development for datacenter hardware, including applying DFM, DOE, thermo-mechanical dynamics, and process optimization.
Ability to drive root cause analysis, corrective actions, and continuous process improvements with cross-functional teams, contract manufacturers, and suppliers.
Demonstrate ability to communicate effectively with multi-geographic teams, collaborate to achieve project goals, contribute positively to the engineering community, manage complex projects spanning multiple technologies.
Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.
2 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology.
Experience with development of PCBA manufacturing processes including acceptance testing, startup, and qualification.
Experience in new site/line/equipment bring-up/transfer and qualification for PCBA and system integration.
