Primary Responsibilities
1. Design & Analysis
Perform signal and power integrity analysis for high‑speed interconnects (PCB, package, MLO, probe card)
Develop and validate electrical models for
Transmission lines, vias, connectors
PDN (Power Distribution Network) structures
Define stack‑ups, impedance targets, and routing constraints.
Evaluate and optimize
Reflections, insertion/return loss
Crosstalk and jitter performance
2. Simulation & Modeling
Use EM and circuit tools (e.g., HFSS, ADS, SIwave, PowerSI) for
Frequency‑domain and time‑domain analysis
Build system/channel models (e.g., IBIS‑AMI, eye diagrams).
Run what‑if studies to optimize performance and reduce design risk.
3. Testing & Validation
Drive simulation-to-measurement correlation and root cause analysis
Define SI validation plans using VNA, TDR, TDT and high‑speed measurement setups
Define test fixtures and correlation structures
Drive design improvements based on measured data
4. Design Support & Collaboration
Provide design guidelines, constraints, and best practices to layout teams and electrical design engineers
Collaborate globally with engineering teams and customers
Support new product development programs (e.g., probe cards, load boards)
5. Continuous Improvement & Innovation
Improve modeling methodologies and design workflows
Reduce simulation cycle time and improve design quality
Stay current with
High-speed interfaces (PCIe, HBM, SerDes)
Emerging packaging and interconnect technologies
Contribute to next-generation architecture and roadmap development
Required Qualifications
BS/MS in Electrical Engineering (or related field)
4+ years of relevant experience in SI/PI analysis and design
Strong understanding of
Transmission line theory
Power integrity principles
Crosstalk and signal degradation mechanisms
Experience with tools such as
HFSS, ADS, SIwave, PowerSI, PowerDC, SPICE, Allegro, MATLAB
Preferred Qualifications
Hands-on experience with measurement tools (VNA, TDR/TDT)
Experience with high-speed interfaces (PAM4, SerDes, PCIe, HBM)
Scripting/automation (Python, MATLAB)
Experience in advanced packaging, probe cards, or fine-pitch interconnects
Core Skills
Analytical problem solving and debugging
High-frequency design expertise
Data interpretation and modeling
Cross-functional communication
Ability to balance modeling accuracy vs. schedule execution
Ability to apply engineering judgement to define model accuracy requirements
Typical Impact
Improves first-pass success rate of designs
Reduces cycle time through simulation-driven design
Ensures compliance with high-speed performance requirements
Minimizes field/customer issues tied to SI/PI performance
Skills
Allegro PCB Designer, ANSYS HFSS, Cadence Tools, High Speed Interfaces, MATLAB, Power Distribution Design, Power Integrity, Probe Cards, PSpice Circuit Simulation, Python (Programming Language), SERDES, Signal Integrity, Signal Integrity Analysis, Transmission Line Design
Education & Experience
Minimum of 5 years of related experience with a Bachelor’s degree; or 3 years and a Master’s degree; or a PhD without experience; or equivalent work | Required
