Skills/Abilities
- Proficiency with high density substrate and packaging layout tools. Experience with Siemens Xpedition is desirable.
- Solid understanding of high-speed design signal integrity best practices.
- Experience with SI/PI analysis using Ansys SIwave and HFSS, Hyperlynx, or other industry standard tools.
Job Description
Duties/Responsibilities
Translates project and system requirements into well-defined hardware architectures working with cross-functional teams.
Innovatively solves issues, drives completion of the project to schedule, and collaboratively works with other technical contributors.
Builds, debugs, and tests prototypes and deliverable hardware.
Prepares documentation for manufacturing, and provides continuous support.
Researches and enables innovative solutions for cutting-edge designs.
Engages other engineers and partners to develop reliable, cost effective end solutions for products.
Drives solutions to complex problems with limited direction – contributes to requirements development, proposes ways forward, and adapts appropriately to changes in requirements.
Independently performs complex electronic architectures and designs.
Able to manage a task with multiple cross functional members and effectively communicates status to project leadership and customers.
Actively mentors less experienced teammates and provides thoughtful, constructive feedback.
Support business development and proposal activities.
Skills/Abilities
Proficiency in electronic design.
Ability to write detailed design specifications.
Excellent verbal and written communication skills.
