Responsibilities
Lead and grow the application engineering function, setting the technical direction for bonding single-crystal diamond to customer devices in advanced packaging and thermal management applications.
Own the bonding technology strategy, including how we evaluate, select, and optimize pressure and pressureless sintering, thermocompression, surface/plasma-activated, hybrid, and emerging bonding methods across different device designs and material stacks.
Direct process development and validation, including surface preparation, metallization, DOE-based optimization, characterization, failure analysis, and reliability testing.
Serve as the senior technical lead on customer programs, from prototyping through qualification, technology transfer, and scale-up to mass production.
Partner with executive leadership, R&D, product, and business development on product roadmaps, resourcing, and new application opportunities, with clear reporting on schedules, technical risks, and results.
- Present technical results and strategy to customers, executives, and industry partners.
- Requirements
- Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field; Master’s or PhD preferred.
10+ years of experience in semiconductor packaging, process engineering, or thermal management, including 3+ years leading engineering teams or programs.
Deep, hands-on expertise in wafer/die bonding technologies and the related processes: surface preparation, thin-film metallization, metrology, failure analysis, and reliability testing.
Strong understanding of advanced packaging architectures (2.5D/3D IC, CoWoS, flip-chip, fan-out) and their thermal management challenges.
Proven record of taking bonding or packaging processes from R&D through qualification and into high-volume manufacturing, including technology transfer to customers or OSATs.
Excellent communication and executive presence; able to translate complex technical issues into clear business decisions for management and customers.
Experience with high-thermal-conductivity materials (diamond, SiC, or similar) is highly desirable.
