Participate in automation improvements that improve tool utilization, data collection, traceability, and manufacturing consistency.
Yield Improvement and Root Cause Analysis
Perform failure analysis and defect characterization to identify root causes of process variation.
Develop and implement process improvements to increase yield, improve film quality, and reduce defectivity.
Lead continuous improvement initiatives focused on productivity, equipment utilization, and process capability.
Documentation and Training
Develop and maintain process documentation, work instructions, FMEAs, process specifications, and control plans.
Train technicians and junior engineers on equipment operation, process control, troubleshooting, and best practices.
Support new equipment installations, process qualifications, and technology transfers.
Education & Experience
Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field.
5+ years of experience in semiconductor PECVD or thin films process engineering.
Skills
Strong understanding of SiNx, SiOx, and other PECVD films, including the relationship between process parameters, gas chemistry, plasma conditions, chamber conditioning, clean cycles, and resulting film properties.
Experience with thin-film metrology including ellipsometry, reflectometry, profilometry, FTIR, stress/bow measurement, SEM, or similar techniques.
Experience in optimizing film thickness, RI, deposition rate, uniformity, stress, and film composition.
Ability to work on-site in a semiconductor manufacturing and cleanroom environment.
Ability to provide off-hours support as needed for critical manufacturing or equipment issues.
Solid background in SPC, Gage R&R, DOE, and root cause analysis.
Proficient in JMP, Excel, and other Microsoft Office software.
Excellent documentation, troubleshooting, and communication skills.
Experience with MES systems (e.g., Camstar) is a plus.
Direct GaAs and/or InP process experience is highly desirable.
Experience with high-volume semiconductor manufacturing.
Knowledge of additional fab areas such as photolithography, etch, or metals.
Familiarity with device-level impacts of film properties and process integration.
Working Conditions
Will be exposed to areas where hand tools and power tools are being operated
Will be exposed to areas where hazardous chemicals or gases are stored
Ability to work in a cleanroom environment per semi-conductor protocol/requirements
Physical Requirements
Work in a class 100/1000 clean room for extended periods
Wear full cleanroom attire (smock, mask, etc.)
Work with and/or around chemicals (such as solids and acids)
Stand for up to 4 hours at a time
Lift up to 16-30 Pounds
Push/Pull up to 16-30 pounds
Sit for up to 4 hours at a time
Safety Requirements
All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.
Quality and Environmental Responsibilities
Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.
Culture Commitment
Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.:
Integrity – Create an Environment of Trust
Collaboration – Innovate Through the Sharing of Ideas
Accountability – Own the Process and the Outcome
Respect – Recognize the Value in Everyone
Enthusiasm – Find a Sense of Purpose in Work
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com.
