Lead cross-functional team to drive yield improvement and product cost reduction postproduction ramp. Perform statistical data analysis and trouble shoot potential root causes for yield excursions.
Work closely with optical sub-assembly and transceiver module team to address issues at contract manufacturer that could be related to chip performance.
Support cost modeling and facilitates actions / decisions towards designing and delivering cost-competitive products.
Skills and other requirements
Hands-on experience with design, process, and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.
Strong statistical data analysis skills (JMP or Minitab etc.).
Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process, and quality control, change management etc.) in a high-volume manufacturing environment is a plus.
Experience with optoelectronic device reliability testing and modeling is a plus.
Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
Strong ability to drive actions and solutions through cross-functional teams.
Education & Experience
Masters or PhD in electrical engineering, physics, material science or equivalent knowledge/experience
10+ years professional experience
Skills
Proficiency with statistical process control, design of experiments, and data base query
Understanding of device physics and the impact of process parameters on performance
Experience performing development in a manufacturing environment
Self-motivated, driven individual with ability to manage multiple projects in a fast pace environment
Ability to communicate results in a clear, concise, and well-organized manner
Working Conditions
Flexibility to support a 24/7 hour manufacturing site
Normal office environment
Clean room environment
Physical Requirements
Ability to lift/push/pull up to 30 lbs.
Ability to adorn clean room environment.
Ability to sit/stand for up to 4 hours at a time.
Safety Requirements
All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.
Quality and Environmental Responsibilities
Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.
Culture Commitment
Ensure adherence to company's values (ICARE) in all aspects of your position at Coherent Corp.: Integrity– Create an Environment of Trust Collaboration– Innovate Through the Sharing of Ideas Accountability– Own the Process and the Outcome Respect– Recognize the Value in Everyone Enthusiasm– Find a Sense of Purpose in Work
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com.
Monitor and improve yield performance across the entire manufacturing flow, including wafer fabrication, electrical and optical testing, and reliability evaluations.
Lead cross-functional teams to investigate yield excursions, identify root causes, and implement CAPA measures promptly.
Support daily production by promptly resolving issues and analyzing failures on the wafer fabrication and testing line.
Collaborate closely with the R&D team to introduce new optoelectronic chips, such as VCSELs, DFB lasers, and photonic integrated chips, for 3D sensing applications.
Conduct design and process sensitivity studies to define EPI/process spec limits and enhance manufacturability.
Lead production ramp-up readiness efforts, ensuring alignment with cross-functional teams on chip design, equipment, process flow, and documentation.
Drive yield improvement and cost reduction post-production ramp, employing statistical analysis to troubleshoot yield deviations.
Work collaboratively with optical sub-assembly and transceiver module teams to address chip-related performance issues at contract manufacturers.
Support cost modeling initiatives and facilitate actions/decisions to design and deliver cost-competitive products.
Own yield bridge activities, providing critical support during new product introduction and the transition to high-volume manufacturing.
Post-graduate degree in Engineering, Physics, Materials Science, or a related field.
A minimum of 4 years of experience in a similar role, preferably within the semiconductor or optoelectronics industry.
Hands-on expertise in designing, processing, and characterizing optoelectronic devices, including VCSELs, DFB lasers, and photonic integrated chips.
Proficiency in statistical data analysis using JMP, Minitab, or similar tools.
Familiarity with semiconductor wafer fab operations in a high-volume manufacturing setting is highly advantageous.
Experience in optoelectronic device reliability testing and modeling is a plus.
Excellent communication skills, with a proven track record of leading effective meetings and facilitating cross-functional collaboration.
A strong ability to drive actions and solutions through cross-functional teams, demonstrating leadership and initiative.
Willingness and ability to work in a cleanroom environment, adhering to safety protocols and quality standards.
Independent work ethic, with the capacity to manage multiple projects simultaneously and adapt to a fast-paced environment.
