Ciena
From Ciena's careers page
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As the global leader in high-speed connectivity, Ciena is committed to a people-first approach.
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
Ciena is seeking a hands-on Manufacturing Quality Engineer to lead new product introduction (NPI), process development, product transfer, and manufacturing readiness activities for semiconductor package assembly and high-reliability electronic products. This role will be responsible for driving manufacturing quality, process validation, yield improvement, and operational readiness across internal manufacturing teams and external manufacturing partners.
The successful candidate will leverage expertise in semiconductor packaging, SMT, flip-chip assembly, die attach, wire bond, BGA characterization, and quality engineering to ensure successful product launches, robust manufacturing processes, and exceptional product quality.
Lead new product introduction (NPI) activities from product transfer through process qualification, validation, manufacturing readiness, and production release.
Develop, qualify, and optimize semiconductor package assembly processes, including SMT, die attach, wire bond, flip-chip, dispensing, underfill, and backend assembly operations.
Drive BGA characterization activities, including stencil optimization, reflow profiling, Design of Experiments (DOE), BGA rework qualification, and assembly process validation.
Establish and maintain PFMEA, Control Plans, Process Flow Diagrams, work instructions, quality plans, and manufacturing process documentation.
Define process controls, SPC monitoring requirements, process capability targets, and Critical-to-Quality (CTQ) characteristics.
Lead root cause investigations and corrective actions utilizing methodologies such as 8D, DMAIC, DOE, 5-Why, and statistical analysis tools.
Support failure analysis activities using AXI, CT scan, cross-sectioning, EDX, dye-and-pry, and other analytical techniques.
Drive yield improvement, defect reduction, process optimization, and continuous improvement initiatives across manufacturing operations.
Manage non-conforming materials, containment activities, MRB reviews, corrective actions, and preventive action programs.
Support supplier quality activities, manufacturing partner audits, process qualifications, and customer quality requirements.
Serve as the primary technical interface for manufacturing readiness reviews, process-related issues, and customer quality escalations.
Conduct DFM/DFX reviews and identify manufacturing risks to improve quality, yield, manufacturability, and operational efficiency.
Education: Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or a related discipline.
Experience: Hands-on experience supporting semiconductor package assembly processes, including flip-chip assembly, dam-and-fill, die attach, and wire bond technologies.
Strong experience with NPI, product transfer, process qualification, validation, and manufacturing readiness activities.
Experience with SMT assembly, BGA processes, reflow profiling, dispensing, underfill processes, and manufacturing process controls.
Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, process capability studies, and yield improvement methodologies.
Strong analytical, problem-solving, communication, and technical documentation skills.
Demonstrated ability to collaborate effectively with engineering, manufacturing, suppliers, customers, and contract manufacturing partners.
Experience managing manufacturing quality and process-related issues in a high-technology manufacturing environment.
Experience supporting advanced packaging technologies, including flip-chip assembly and large BGA characterization.
Knowledge of quality methodologies including FMEA, 8D, DMAIC, SPC, Cp/Cpk, and root cause analysis techniques.
Experience utilizing failure analysis methods such as AXI, CT scan, cross-sectioning, EDX, and related diagnostic tools.
Experience working with EMS, ODM, or contract manufacturing partners.
Six Sigma Green Belt, Black Belt, CQE, or equivalent quality certification.
Experience supporting optical, photonics, telecommunications, semiconductor, or high-reliability electronics manufacturing environments.
Knowledge of supplier quality systems, audits, qualification processes, and manufacturing excellence frameworks.
Additional Advantage: Chinese language capability to support regional supplier and manufacturing partner interactions.
Successful execution of new product introductions and manufacturing transfers.
Robust, scalable, and capable manufacturing processes.
Improved manufacturing yields and reduced defect rates.
Effective root cause investigations and sustainable corrective actions.
Strong supplier, manufacturing partner, and customer quality performance.
On-time completion of manufacturing readiness, qualification, and production milestones.
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At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
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