Lead the buy-off and qualification of new equipment to support production scaling, collaborating closely with Product, Quality, and R&D teams.
Drive New Process Integration (NPI) and formal process transfers from the design phase to high-volume manufacturing.
Lead change management initiatives by establishing rigorous process change qualification methods and presenting comprehensive data to stakeholders for approval.
Perform deep-dive root cause analysis and implement robust Corrective and Preventive Actions (CAPA) to resolve process excursions and eliminate defect sources.
Define and execute comprehensive process control plans, including Statistical Process Control (SPC) strategies, FMEA, and Out-of-Control Action Plans (OCAP).
Partner with cross-functional teams (equipment, integration, quality, R&D) and external foundries to align technical goals with operational strategies.
Analyze statistical data to identify yield detractors, optimize equipment utilization, and improve operational efficiency to lower the cost-per-die.
Establish dashboards and KPIs to track the health of wafer scribe and laser bar stack/unstack processes; monitor daily cycle times, flag critical issues immediately, and provide periodic management reports.
Create and maintain Standard Operating Procedures (SOPs), technical reports, change management documents, and data analysis for assigned backend processes
Qualifications
Master’s Degree in Engineering (Physics, Electrical Engineering, or Mechanical Engineering).
5–15 years in backend processes, including 5+ years of hands-on experience with dicing, scribe & cleave, Pick-and-Place (PnP), automated bar-handling, AVI tools, burn-in processes, wafer mounting tools, hoop ring tape transfers, and mechanical/precision engineering concepts.
Strong fundamentals in statistics and working knowledge of SPC, DOE, FMEA, DMAIC, as well as advanced tools such as JMP, Tableau, and SQL.
Demonstrated knowledge of process capability indices (Cpk, Ppk), equipment reliability metrics (MTBA, MTBF), and statistical comparison of tool-to-tool performance.
Solid knowledge of laser (DFB, EML, VCSEL) manufacturing principles using InP (Indium Phosphide) and GaAs (Gallium Arsenide) materials.
Strong data analysis skills with the ability to swiftly handle, join, filter, and group large datasets for critical business decisions, alongside proficiency in JMP scripting and programming for data analysis and reporting automation.
Energetic, resilient leader with excellent interpersonal and presentation skills, capable of communicating complex data effectively to leadership and adapting to high-stress, fast-paced environments.
Experience in AutoCAD and SolidWorks is an added advantage.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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