Record-Breaking Scale & Complexity: We regularly execute full-chip physical implementation for ultra-large-scale ASICs exceeding tens of billions of transistors, multi-gigahertz clock frequencies, and dense multi-die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures).
Methodology & Flow Leadership: We develop and maintain cutting-edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn-around-time (TAT).
About the Role
Broadcom’s ASIC Products Division (APD) is looking for a motivated Physical Design Engineer (NCG) to join our Physical Design team. In this role, you will work alongside experienced engineers in executing the implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will gain hands-on experience in complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14).
Key Responsibilities
Participate in block-level floorplanning, and run placement and route (P&R) flows using industry-standard EDA tools.
Perform Static Timing Analysis (STA), debug timing paths, and execute ECOs for timing closure.
Run Physical Verification checks (DRC, LVS, ERC, Antenna) and resolve signoff violations.
Analyze IR drop and electromigration (EM) to ensure power grid integrity.
Develop and maintain automated scripts (TCL, Python, Ruby) to enhance flow efficiency and productivity
Basic Qualifications
Education: Bachelor's Degree in Electrical Engineering, Computer Engineering + 2yrs of experience or Master’s degree in Electrical Engineering, Computer Engineering (Graduation date within the past 12 months).
Solid understanding of digital CMOS logic design, standard cell libraries, and semiconductor fundamentals.
Familiarity with static timing analysis (STA) concepts, clocking, and setup/hold timing.
Hands-on coursework, lab experience, or academic projects using EDA design tools (Cadence Innovus/Tempus, Synopsys IC Compiler II/PrimeTime, or Siemens tools).
Proficient in scripting languages such as TCL, Python, Ruby, or Bash.
Preferred Qualifications
Prior internship or research experience in ASIC physical design, synthesis, or physical verification.
Basic understanding of Design for Testability (DFT), low-power intent (UPF/CPF), and FinFET technologies.
Excellent problem-solving, debugging, and analytical skills.
Work Authorization / Eligibility Requirements
Legal authorization to work in the U.S. is required
Compensation and Benefits
The annual base salary range for this position is USD 82,500.00 To USD 132,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
