Perform nanoprobing (SEM-based) for BEOL and FEOL electrical characterization and defect isolation (EBAC, EBIRCH, EBIC).
Execute sample preparation and physical analysis: physical deprocessing of ICs and packages (mechanical, chemical, PFIB), backside thinning, cross-section SEM/TEM, elemental analysis (EDS).
Correlate design-based FA results (scan diagnosis, memory bitmapping) and ATPG/DFT results with physical localization to drive root cause on resistive and systematic defects.
Collaborate with global cross-functional teams to identify root causes of failures from various stages of the product lifecycle (e.g., design, prototype, reliability, RMA, yield).
Communicate complex FA findings effectively (written and verbal), enabling data-driven corrective actions to resolve critical quality issues.
Develop and implement new FA methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.
Required Qualifications
Please apply only if you meet all of the following
BS, MS, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
8+ years of hands-on semiconductor failure analysis experience, with a demonstrated history of root-causing failures at 16nm or below and/or in 2.5D packages.
Full-flow FA experience: electrical verification, non-destructive analysis, backside fault isolation on flip-chip and/or 3D devices, deprocessing, physical analysis, and technical report writing
Extensive hands-on expertise in fault isolation and/or nanoprobing, including tool operation, data interpretation, and the ability to choose appropriate EFA/PFA analysis techniques based on the failure signature.
Highly Desired Qualifications
Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
Experience with <5nm finFET or GAAFET technologies.
Experience with 3DICs, CoWoS-L, CoPoS, co-packaged optics/copper (CPO/CPC).
Experience with high-speed digital and mixed-signal failure analysis.
Expertise in design-based FA (scan and memory diagnostics).
FA-specific ATE test flow generation, pattern modification, and hardware.
Excellent problem-solving skills and a methodical approach to root cause analysis.
Ability to work independently and as part of a team.
Broad interests, self-driven, and a lifelong learner.
Manage multiple root cause projects in parallel in a fast-paced environment.
Compensation and Benefits
The annual base salary range for this position is USD 109,700.00 To USD 175,500.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
