Working at the intersection of mechanical, thermal, electrical, and RF engineering, you will solve challenging problems involving EMI/EMC isolation, high-power-density thermal management, and survivability in the launch environment. You will own the enclosure’s physical architecture, interfaces, manufacturability, and environmental robustness while partnering closely with RF and electrical engineers to verify electromagnetic and electrical performance.
This role requires strong problem-solving skills, sound mechanical judgment, hands-on hardware experience, and enthusiasm for developing novel design solutions
Role
Design, analyze, build, and test space-grade electronics enclosures, RF housings, and PCBA mounts.
Implement effective RF isolation and EMI shielding techniques, including gasketing, cavity design, and precision machining interface controls.
Collaborate closely with RF, Electrical, and Systems engineering teams to develop requirements for mechanical constraints, connector interfaces, signal integrity, and environmental loads.
Integrate electronics units into the spacecraft design, developing procedures to optimize assembly, wire routing, and thermal interface material application.
Requirements
B.S. or M.S in mechanical, aerospace engineering or equivalent
5+ years of experience in mechanical design with a focus on electronics packaging, RF packaging, or enclosure design.
Proficiency in mechanical 3D CAD (e.g., SolidWorks, NX, or Creo).
Strong fundamentals in mechanical design, structural design, and thermal management for printed circuit board assemblies (PCBAs) and their enclosures.
Practical knowledge of RF isolation techniques and EMI/EMC mitigation strategies in mechanical enclosures.
Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability.
Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly processes.
Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria.
Bonus
Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings.
Experience with mechanical and/or thermal FEA (e.g., ANSYS, Femap/NX Nastran, Thermal Desktop).
Experience designing electronics enclosures for radiation and vacuum environments.
Experience designing hardware to withstand severe launch vibration, shock, and thermal cycling environments.
Hands-on experience with environmental testing (TVAC, vibration/shaker tables, thermal chambers, and EMI/EMC chambers).
Experience designing chip and wire RF housings for integrated antenna feed systems.
What we offer
All our positions offer a compensation package that includes equity and robust benefits.
Base pay is just one component of Astranis’s total rewards package. Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals.
Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources. The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position.
Base Salary Level I
$155,000—$195,000 USD
Base Salary Level II
$185,000—$235,000 USD
U.S. Citizenship, Lawful Permanent Residency, or Refugee/Asylee Status Required
(To comply with U.S. Government space technology export regulations, applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3))
Our mission and products are built for everyone, regardless of gender, race, creed, or background. We believe in a diverse and inclusive workplace, and we invite all people to join our team and bring their unique perspectives to make us stronger.
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