Key Responsibilities
HVM Productivity & Process Robustness
Drive engineering solutions that transition advanced process capability from development into high-volume manufacturing.
Establish HVM requirements for process stability, repeatability, chamber matching, uptime, defectivity, consumable lifetime, and productivity.
Balance process performance with equipment productivity and manufacturing requirements.
Use equipment and process data to identify performance gaps and prioritize improvements.
Drive systematic root-cause analysis and continuous improvement for customer HVM issues.
Ensure new technologies are designed not only to demonstrate best process performance but also to deliver sustainable manufacturing value.
Operational Excellence & Flawless Execution
Lead and manage with a strong sense of urgency and hold every team member accountable for rapid response, timely decisions, and follow-through on commitments; mobilize cross-functional resources quickly to address customer needs while maintaining alignment and transparent communication.
Standardize best practices across programs and global teams to improve quality, cycle time, productivity, and HVM readiness.
Proactively identify technical, resource, schedule, and customer risks; ensure rapid containment, root-cause resolution, and prevention of recurrence.
Drive first-time-right engineering through rigorous requirements, design and process reviews, change control, qualification discipline, and learning capture.
Establish operating rhythms and performance indicators that improve execution predictability, issue visibility, and timely decision making.
Translate strategy into executable plans with clear milestones, accountable owners, decision gates, risk controls, and measurable outcomes.
Engineering & Organizational Leadership
Lead and develop directors, managers, senior technical leaders, and productivity engineering teams.
Build a culture of technical excellence, customer focus, innovation, accountability, and execution.
Develop the next generation of technical and organizational leaders.
Drive effective collaboration among process engineering, systems, hardware, software, applications, product, field, and customer teams.
Establish clear priorities, technical decision mechanisms, ownership, and success criteria.
Build organizational capabilities required for future etch and patterning technology generations.
Advanced Patterning System & Application Leadership
Provide technical and strategic guidance for innovative plasma patterning systems and applications.
Drive process and hardware co-optimization to improve performance, process-window robustness, chamber stability, and manufacturability.
Lead resolution of complex process, chamber, hardware, and system-level problems.
Translate application requirements into equipment capability and technology-development priorities.
Leading-Edge Customer Adoption
Lead technical engagements with advanced logic, foundry, and memory customers from initial evaluation through production adoption.
Understand customer device and technology roadmaps and translate future requirements into product and process-development priorities.
Build trusted technical partnerships with customer engineering, integration, technology-development, and manufacturing organizations.
Accelerate conversion of differentiated technology into customer adoption and production-of-record applications.
Required Knowledge & Experience
The successful candidate should demonstrate strong technical knowledge, management skills, and leadership experience in:
Minimum of 15 years of relevant technology and engineering leadership experience in the leading-edge semiconductor fabrication or equipment industry.
Advanced degree in engineering, applied physics, materials science, or a related technical discipline preferred.
Ability to lead by example in a fast-paced, customer-driven environment, execute work in the office, collaborate closely with customers and account teams, and support frequent nighttime calls across global time zones; expect the same urgency, responsiveness, and ownership from every team member.
Ability to set direction, develop technical talent, influence across organizations, and convert technology strategy into measurable customer and business results.
Ability to understand leading-edge customer roadmaps, identify critical technology gaps, and build trusted technical partnerships.
Ability to direct the resolution of highly complex or unusual technical and business problems applying advanced analytical thought and judgment.
HVM & Operational Excellence Mindset: Ability to convert excellent process performance into stable, repeatable, productive, and economically valuable manufacturing solutions through disciplined execution and continuous improvement.
Plasma etch equipment and process technology development.
Plasma physics, plasma chemistry, surface reactions, ion/radical interactions, RF power and bias control.
Patterning profile, critical dimension (CD), selectivity, uniformity, loading, defectivity, and process-window control.
Chamber hardware and process interactions.
EUV patterning technology development and integration.
Advanced logic, foundry, IDM, and memory patterning requirements.
Leading-edge foundry and IDM technology development, production ramp, and HVM operations.
Equipment and process co-optimization.
Ability to travel domestically and internationally 25–50% of the time, including on short notice to provide on-site support for customer or business needs.
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
Yes, 25% of the Time
Relocation Eligible
No
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
