Key Responsibilities
Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
Perform hardware characterization on a variety of difficult systems, within safety guidelines
Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
Generate internal and external documentation for products, presentations and technical reports
Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision
Measure film properties and interpret data
Identify, select and work with vendors and suppliers with limited supervision
Implement new technology, products and analytical instrumentation
Requirements
PhD or Master or Bachelor in Materials Science, Chemical Engineering, Chemistry or Physics or related field
At least 2 years of relevant experiences in semiconductor packaging process, e.g. Fan-Out Wafer Level Packaging, Panel-level Packaging, Thermo-Compression Bonding, Hybrid Bonding, Die Attach, etc.
Good communication and interpersonal skills
Problem-solver attitude with determination and quality-mindset
Work Location
Science Park II (Moving to Tampines starting from mid-2027)
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
No
Relocation Eligible
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
