This internship provides hands-on exposure to semiconductor manufacturing equipment, process development methodologies, statistical data analysis, and advanced packaging technologies.
Key Responsibilities
Process Development
Assist engineers in designing and executing process engineering experiments.
Support development and optimization of CVD, PECVD, PEALD, or related thin film deposition processes.
Perform wafer processing and experimental runs according to defined procedures.
Analyze process results and identify opportunities for performance improvement.
Characterization & Data Analysis
Collect and analyze process and metrology data.
Characterize film properties including
Thickness
Uniformity
Refractive Index
Stress
Composition
Surface Roughness
Electrical Properties
Utilize statistical methods and data visualization tools to identify trends and correlations.
Film characterization and integration test on AMAT internal test vehicle
Problem Solving
Support troubleshooting of process and equipment-related issues.
Participate in structured root cause analysis activities.
Document findings and propose corrective actions.
Documentation & Communication
Maintain accurate experimental records and engineering logs.
Prepare technical reports and presentations summarizing findings.
Present project progress and final internship results to engineering leadership.
Cross-Functional Collaboration
Work with Process, Hardware, Manufacturing, and Product Engineering teams.
Participate in technical discussions and project review meetings.
Support customer-focused development activities where appropriate.
Preferred Project Areas
Depending on business priorities, interns may be assigned projects related to:
Low-temperature dielectric deposition
Advanced packaging materials development
Wafer bonding process optimization
Gap fill process development
Film characterization and metrology correlation
Process hardware characterization
Process automation and data analytics
AI-assisted process optimization
Qualifications
Preferred Qualifications
Knowledge of semiconductor manufacturing processes.
Basic understanding of thin film deposition, plasma processing, or surface science.
Experience with experimental design and data analysis.
Strong problem-solving and analytical skills.
Effective verbal and written communication skills.
Ability to work independently and collaboratively in a team environment.
Learning Outcomes
By the end of the internship, the intern will gain experience in
Semiconductor process development methodology
Advanced packaging technologies
Experimental design and DOE execution
Thin film characterization techniques
Engineering problem solving and root cause analysis
Technical presentation and communication skills
Working in a global semiconductor equipment company
Additional Information
Time Type
Full time
Employee Type
Intern / Student
Travel
No
Relocation Eligible
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
