About the Role
As a Process Support Engineer (PSE) for Applied Materials' 2D/3D X-ray inspection and metrology platform, you will play a critical role in bringing a new non-destructive inspection capability into high-volume HBM (High Bandwidth Memory) manufacturing at a leading memory customer. You will lead customer demos and evaluations, develop imaging and analysis recipes, and translate 3D X-ray data into actionable yield insight correlating X-ray results with electrical test, physical failure analysis, and process data.
Working closely with the customer's HBM process, integration, and FA(Failure Analysis) teams, the PDC (Process Diagnostic and Control) organization, and the global X-ray product/R&D team, you will help define how X-ray inspection and metrology are used to control microbump, TSV, and die-stacking processes for next-generation HBM generations.
Role Responsibilities
Drive X-ray inspection tool adoption at the customer, from demo to joint development and tool installation, with on-site support for qualification and issue resolution
Develop and optimize 2D/3D X-ray imaging recipes for HBM stacks (microbumps, TSVs, hybrid-bonding interfaces), balancing resolution, sensitivity, and throughput
Detect and quantify yield-critical defects (non-wet, bridging, voids, cracks) and stack metrology (bump height, die shift, tilt)
Apply automated analysis and AI/ML-based image enhancement; design DOEs and correlate X-ray data with electrical test and FA results
Serve as the technical liaison between the customer and the global X-ray product team, feeding field requirements into the roadmap
Act as a resource for junior colleagues and lead small projects with manageable risk and resource requirements
Minimum Qualifications
Bachelor's degree in materials science/engineering, physics, chemistry, electrical engineering, optoelectronics, or a related field
4–7 years of experience in memory fab, HBM/back-end packaging, or semiconductor equipment industry, preferably in Inspection/Metrology or failure analysis
Hands-on experience with data analysis and statistics (e.g., JMP, Python, MATLAB) and with structured problem solving / root cause analysis
Strong interpersonal and communication skills to explain sensitive technical information and build consensus among customer and internal stakeholders
Communication proficiency in English (written and verbal)
Preferred Qualifications
Master's degree or PhD in a related field
Experience with X-ray CT/XRM, 2D X-ray inspection, or 3D image analysis (reconstruction, segmentation, volume metrology)
Knowledge of HBM stacking processes: TSV, microbump plating, MR-MUF / TC-NCF bonding, hybrid bonding, and underfill
Experience with failure analysis methods (cross-section, SEM/FIB, SAT/C-SAM) and correlating them with inline or electrical test data
Experience applying machine learning / deep learning to image data (denoising, super-resolution, defect detection/classification)
Experience leading customer evaluations, demos, or joint development projects with memory customers
Understanding of X-ray physics fundamentals (source/detector, contrast, dose, artifacts) is a plus
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
Yes, 20% of the Time
Relocation Eligible
No
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
