Leads the execution teams ß-sites, evaluation and demos at customers site, through high involvement in the SOW and commitment schedule
Interfaces with the customer regarding technical requirements analysis and schedule
Define/approve Product application support plans for installation
Create & Lead new methodologies in order to optimized system performance for specific application
Analysis, Develop and Transfer new application capabilities in the system envelope from product division to customer application support team
Lead customer Technical review meetings
Functional Knowledge
Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines
Business Expertise
Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market
Leadership
Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements
Problem Solving
Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information
Impact
Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies
Interpersonal Skills
Explains difficult or sensitive information; works to build consensus
Senior Applications Engineer – Semiconductor 3D X-ray Solutions
As an Applications Engineer, you will join an exciting and growing team of scientists, engineers, and research professionals, focused on advancing 3D X-ray solutions for semiconductor applications. You will collaborate closely with customers and internal teams to enable cutting-edge inspection, metrology, and failure analysis workflows.
Key Responsibilities
Lead system demonstrations for semiconductor customers, including fabs, FA labs, and R&D centers
Develop new applications and methodologies tailored to semiconductor devices, processes, and packaging technologies
Provide critical input to product development by informing system specifications based on customer needs and application gaps
Deliver advanced customer training on system operation, data acquisition, and analysis workflows
Design, develop, and optimize robust workflows for semiconductor inspection and analysis
Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases
Serve as a technical leader in customer-facing support activities, including:
Delivering high-impact technical presentations and demos
Supporting industry conferences and trade shows
Authoring technical papers and presenting at conferences
Customer Base
Our customers include semiconductor manufacturing facilities (fabs), failure analysis (FA) laboratories, and advanced R&D organizations working at the forefront of device innovation.
Role Impact
In this role, you will act as a key technical interface between engineering, sales, and marketing, serving as the voice of the semiconductor customer. You will partner with external clients and internal development teams to:
Establish best-in-class workflows for routine semiconductor inspection and analysis
Identify and unlock new applications of 3D X-ray technology across front-end and back-end processes
Solve high-value problems (HVPs) related to yield, reliability, process development, and advanced packaging
Essential Qualifications
BS or MS degree in a relevant technical field (e.g., Materials Science, Physics, Electrical Engineering, or related discipline)
3–5 years of experience in a semiconductor-related field (e.g., fabs, failure analysis, metrology, or process development)
Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment
Ability and willingness to travel up to 30% (domestic and international)
Preferred Qualifications
Background in microscopy or advanced imaging techniques (e.g., X-ray CT, SEM, FIB)
Working knowledge of X-ray absorption principles and imaging/optical fundamentals
Experience with semiconductor capital equipment, particularly in inspection, metrology, or FA workflows
Familiarity with advanced semiconductor technologies (e.g., 3D IC, heterogeneous integration, advanced packaging)
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
Yes, 25% of the Time
Relocation Eligible
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
