As an Advanced Packaging Integration Engineer, you will lead process integration for high‑performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, suppliers, and cross‑functional teams across Applied Materials and external partners. You will work closely with design, process, integration, and metrology teams to deliver production‑ready solutions.
Key Responsibilities
Define, develop, execute, and optimize advanced packaging process integration flows (e.g., hybrid bonding, 2.5D/3D heterogeneous integration), to ensure the highest possible product performance, yield, and reliability.
Own, manage, and drive complex technical projects, track progress and solve roadblocks to ensure on time delivery with high quality.
Design experiments, systematically collect and analyze data, drive root-cause analysis and implement corrective actions.
Collaborate with foundries, OSATs, and internal research teams to define and implement improved integration strategies and methodologies.
Stay abreast of the latest field advancements. Apply such knowledge to drive innovations.
Qualifications
Ph.D. or M. S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.
Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.
Experience with MES systems is a plus.
Ability to prepare clear, compelling executive‑level or customer‑facing presentations is a plus.
Self‑starter with strong problem‑solving skills; able to work both independently and in team environments with minimal supervision.
Additional Information
Time Type
Full time
Employee Type
Assignee / Regular
Travel
Yes, 10% of the Time
Relocation Eligible
Yes
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.
