Identify semiconductor and package reliability risks during product and technology development, using methodologies such as FMEA and DOE.
Lead root cause investigations of reliability failures using structured problem-solving methodologies.
Collaborate with Failure Analysis teams to identify physical failure mechanisms and implement corrective actions.
Support new product reliability qualification, supplier qualification, process changes, manufacturing transfers, and ongoing reliability monitoring in production.
Provide technical leadership across cross-functional development teams.
Interface with strategic customers on qualification results, reliability assessments, and field quality concerns.
Basic Qualifications
B.S. degree in Electrical Engineering, Materials Science, Mechanical Engineering, Reliability Engineering, or related technical discipline.
5+ years of semiconductor reliability engineering experience.
Experience developing and executing semiconductor qualification plans.
Hands-on experience with semiconductor reliability test equipment, bench characterization methodologies, and failure analysis techniques.
Working knowledge of JEDEC qualification and reliability standards.
Strong understanding of semiconductor device physics, package reliability, and failure mechanisms.
Strong analytical, problem-solving, and statistical data analysis skills. Experience with JMP, Minitab, Python, MATLAB, or similar analytical tools.
Excellent communication and cross-functional leadership skills.
Desired Qualifications
M.S. or Ph.D. in a relevant engineering discipline.
Direct experience with power management products for servers, AI accelerators, networking, and/or cloud infrastructure.
Expertise in power semiconductor technologies including Silicon MOSFET, GaN, SiC, and/or power management ICs.
Deep knowledge of semiconductor reliability physics, wear-out mechanisms, and lifetime prediction modeling.
Prior experience with reliability board PCB design or procurement.
Experience operating semiconductor automated test equipment (ATE).
Prior working knowledge of board-level reliability, thermal characterization, power cycling, and/or mission profile analysis.
Familiarity with advanced packaging technologies including WLCSP, flip-chip, FCBGA, QFN, and power modules.
Experience leading customer-facing reliability reviews and qualification programs.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
- EEO is the Law: Notice of Applicant Rights Under the Law.
- Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $130,168 to $188,490.
Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
